Nov 10, 2016 
NPL Electronic Interconnection Group undertakes a wide range of research and collaborative projects in support of the electronics industry. The session will provide information on current project portfolio and capability. The group is now deciding it’s research programme for the next 3 years. We would like to present our vision and give you the opportunity to influence the research priorities. A list of potential subject areas is given below. The session will also explain how you and your company can be involved in our projects and influence project parameters to best reflect your requirements. NPL’s next three-year research programme starts in April 2017
To book your place Click Here https://attendee.gotowebinar.com/register/2994437833425272067
Interconnection topics
Metrology for harsh environment electronics
High temperature interconnects and substrates
High voltage SIR testing
Condensation of end-user assemblies
Ageing of coatings
Metrology for flexible and printed electronics
Combinational testing for reliability prediction
Wearables testing
Printed electrode and sensor characterisation
Metrology for embedded electronics
