Jun 13, 2017 
(Albany, NY) June 13, 2017 – YINCAE has developed a new, innovative, highly filled, room temperature flow, capillary underfill: SMT 158UL. SMT 158UL is a highly filled capillary underfill designed to flow into gaps as small as 10µm at room temperature without pre-heating a substrate. As a result, SMT 158UL eliminates additional steps required for traditional capillary underfills, thus reducing process time and costs. In addition to costs savings, SMT 158UL offers excellent reworkability, very good drop test and thermal cycling performance, as well as easy storage conditions. These results point to SMT 158UL being the next generation board level underfill for the Microelectronics industry.
Additional information regarding SMT 158UL is available by contacting YINCAE at info@yincae.com.
If you wish to visit the official website of YINCAE Advanced Materials, LLC, please visit us at: www.yincae.com
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Founded in 2005 & headquartered in Albany, New York, YINCAE Advanced Materials is a leading manufacturer and supplier of high-performance coatings, adhesives and electronic materials used in the microchip & optoelectronic devices. YINCAE products provide new technologies to support manufacturing processes from wafer level, to package level, to board level and final devices while facilitating smarter and faster production and supporting green initiatives.
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