BTU Launches New TrueFlat Technology to End Die Tilt at SEMICON Taiwan

BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, today announced plans to introduce its new TrueFlat technology, an optional configuration of the PYRAMAX™ convection reflow oven. The unique technology for substrate flatness will be introduced for the first time in Booth 1314 at SEMICON Taiwan, scheduled to take place Sept. 13-15, 2017 at the Taipei Nangang Exhibition Center in Taipei, Taiwan.

Designed for substrate thicknesses of 0.15 to 0.30mm, TrueFlat technology ends die tilt. The result is consistent and repeatable flatness, and superior thermal uniformity due to the PYRAMAX’s closed-loop convection heating.

The new PYRAMAX with TrueFlat technology does not impact reflow oven footprint, making it easy to transition from existing reflow processes. Easy to maintain with no vacuum pump, the system offers simple operation and full integration with BTU’s proprietary WINCON™ Windows-based software including factory host/MES interface for Industry 4.0 compliance.

Joe Yang, BTU product manager, commented, “PYRAMAX with TrueFlat technology is a factory-ready solution to end die tilt. It simplifies process transfer and maintenance, and provides a perfectly uniform and repeatable thermal process as well as flatness control. PYRAMAX is already the reflow oven of choice for the most advanced packaging applications, and this new technology extends its usefulness even further.”