Nov 08, 2017 
Nordson MARCH will be ready to discuss plasma technologies for printed circuit board, microelectronics, and semiconductor packaging in stand A2.345/445 at Productronica 2017
Nordson MARCH, a Nordson company (NASDAQ:NDSN), a global leader in plasma processing technology, will be ready to discuss plasma technologies for printed circuit board, microelectronics, and semiconductor packaging in stand A2.345/445 at Productronica, the world’s leading trade fair for electronics development and production, to be held in Munich, Germany, November 14-17, 2017.
Nordson MARCH’s VIA systems for the plasma treatment of printed circuit boards are the benchmark for panel and roll-to-roll processing. The SPHERE systems for wafer processing are designed to handle all wafer sizes up to 450mm including 300mm wafers on wafer frames, making Nordson MARCH the natural partner for plasma systems for wafer level packaging.
For more information, contact Nordson MARCH at info@nordsonmarch.com.
