Feb 02, 2018 The IWLPC Technical Committee is pleased to announce the Best of Conference, Best Presentation & Best Papers in WLP, 3D, Advanced Manufacturing and Test tracks as chosen by the technical committee and attendees based on technical merit, relevance, originality, knowledge of subject, quality of material, and quality of presentation.
Best of Conference Presentation - Guilian Gao, Ph.D., XPERI/Invensas
“Development of Hybrid Bond Interconnect Technology for Die-To-Wafer and Die-to-Die Applications”
Best of Conference Paper - Wolfram Steller, Ph.D., Fraunhofer IZM AAID
“Dual Side Chip Cooling Realized by Microfluidic Interposer Processing on 300mm Wafer Diameter”
Best of 3D Track Paper - Wolfram Steller, Ph.D., Fraunhofer IZM AAID
“Dual Side Chip Cooling Realized by Microfluidic Interposer Processing on 300mm Wafer Diameter”
Best of WLP Track Paper - Tanja Braun, Ph.D., Fraunhofer IZM
“Fan-Out Wafer and Panel Level Technology for Advanced LED Packaging”
Best of Advanced Manufacturing and Test Track Paper - Paul Werbaneth, Intevac, Inc.
“Process and Productivity Results from a Carrier-Based Linear Transport PVD Systems for RDL Seed Layer Deposition in Fan-Out Packaging Applications”
IWLPC brings together the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV and integrated system packaging.
Going into its 15th year, the IWLPC is co-produced by Chip Scale Review, the leading international magazine addressing the semiconductor packaging industry, and SMTA, the distinguished global association representing electronic assembly and manufacturing professionals.
The conference comprises three parallel technical tracks with two full days of presentations on wafer-level packaging, 3D integration, and advanced manufacturing and test. Professional development courses, keynote speakers, and panel discussions are offered by world-class experts and enable attendees to broaden their technical knowledge. The technical program includes a two-day expo where 60+ exhibitors showcase their latest technologies and products. The conference provides a collective network of over 800 industry professionals, including vendors from leading semiconductor companies, foundries, and OSATS, as well as key technology, equipment, and materials suppliers in the exhibit area. Attendees will be inspired by the quantity and quality of the featured new developments and emerging technologies. The 15th Annual Conference will be held October 23-25, 2018 in San Jose, CA. For more information visit: www.iwlpc.com
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