Apr 04, 2018 
ZESTRON, the globally leading provider of high precision cleaning products, services and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce that it will host the “Defluxing Advanced Packages” webinar on Thursday, April 26th, from 1:30 PM to 2:30 PM EDT. This is the second installment of the ZESTRON Academy 2018 Cleaning Webinar Series, and will be presented by Senior Application Engineer, Ravi Parthasarathy, M.S.Ch.E.
In order to increase power module yield and reliability, companies are developing new power packaging products targeting the common failure locations, die and substrate attach, interconnection and encapsulation. This has resulted in increased performance requirements involving greater packaging density and various material mix. This webinar provides an overview of potential failures that one can expect by selecting an inappropriate chemistry and addresses important factors to be considered when selecting an optimum cleaning agent.
“We invite both new and experienced industry members to attend this free webinar as we’ll review how newly improved cleaning agent formulations provide superior material compatibility and cleanliness ensuring high reliability for advanced packages,” said Sal Sparacino, Sales and Marketing Manager, ZESTRON Americas.
For more information or to register for this free webinar, visit here.
Headquartered in Manassas, Virginia, and operating in more than 35 countries, ZESTRON is the globally leading provider of high precision cleaning products, services and training solutions for the electronics manufacturing industry. With seven worldwide technical centers and the largest team of engineers focused on high precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal. For additional information and to tour one of our unparalleled technical centers, please visit www.zestron.com.
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