Jul 19, 2018 
SHENMAO America, Inc. is pleased to introduce the PF606-PW215 water-soluble solder paste. The company offers a full line of water-soluble fluxes and solder pastes for SMT and IC packaging applications. SHENMAO provides halide-containing and halide-free fluxes for tin/lead as well as lead-free solder alloys.
PF606-PW215 boasts superior continuous high-speed printability that produces great solder paste print quality as well as a wide reflow process window for excellent solderability. Additionally, the paste has a long shelf and stencil life as well as excellent wetting and clean-ability. Benefits include:
- Anti-slump properties that remain 6 to 12 hours after print time
- Substantial deposition remains 12 hours after printing
- Tack force that remains at >130gf after 24-hour stand
- Paste activity that remains after 19-hour stand No flux residue after cleaning
SHENMAO is dedicated to producing solder products including water-soluble and no-clean solder paste, laser solder paste, solder preform, cored solder wire, wave solder bar alloys and wave soldering fluxes. Additionally, the company offers extremely pure solder powder up to Type 8, BGA and micro BGA solder sphere, wafer-level packaging solder paste and fluxes, LED die attach paste, high-performance liquid fluxes, solder preform, solar ribbon and plating anode used in PCB fabrication, assembly and semiconductor packaging processes.
SHENMAO has successfully been approved by many international well-known electronic manufacturers. The company strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. SHENMAO America, Inc. blends SMT solder paste at its facility in San Jose, CA for distribution in North America.
SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes. For more information, please visit www.shenmao.com.
