Jul 15, 2019 
ZESTRON, the global leading provider of high precision cleaning products, services, and training solutions to the electronics manufacturing and semiconductor industries, is pleased to announce that it will host “Defluxing Advanced Packages” on Thursday July 25th, from 1:30 PM to 2:30 PM EDT. This is the fifth installment of the 2019 ZESTRON Academy Cleaning Webinar Series. Our presenter will be electronics cleaning expert, Ravi Parthasarathy, M.S.Ch.E, Senior Application Engineer.
Webinar Abstract:
To increase power module yield and reliability, many in the electronics industry are developing new power packaging products. There is particular interest in targeting common failure locations such as die and substrate attach, interconnection, and encapsulation. The increase in packaging density and introduction of new materials makes it more challenging than ever to meet performance requirements. Through a series of case studies, this ZESTRON Academy webinar provides a look at factors to consider when selecting cleaning agents and optimizing cleaning processes to ensure material compatibility and maximize reliability.
For more information or to register for this free webinar visit us online.
ZESTRON is headquartered in Manassas, Virginia and operates in more than 35 countries. With eight technical centers worldwide and the industry’s most knowledgeable team of engineers focused on high precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.
