Oct 26, 2019 
Laserssel Co., LTD announces that it was awarded two 2019 Mexico Technology Awards in the categories of Soldering Equipment – Laser for its LSR (Laser Selective Reflow) and Bonding for its cLSR. The awards were presented to the company during a Wednesday, October 23, 2019 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.
LSR is a revolutionary soldering technique that enables the industry to solder temperature sensitive, warpage prone, very fine pitch, odd form, big die, SiP, wearables, flex to flex, and various other mainstream and niche applications defect-free, high yield and with a low cost of ownership.
The BSOM (Beam Shaping Optical Module): This patented industry-leading technology takes the energy of a spot laser and turns it into a uniformly distributed area laser. The uniformity of the energy is more than 95 percent. This means that the energy of the spot laser is spread out evenly allowing for the same amount of energy density over the entire area to be soldered. This enables the proper coalescence, wetting, intermetallic formation to take place forming the final electronic interconnect or solder joint. Laserssel designs and manufactures this technology in-house.
The Mexico Technology Awards acknowledge the latest innovations available in Mexico produced by OEM manufacturing equipment and materials suppliers over the last 12 months.
With its extensive knowledge in laser technology and expertise in process technology, Laserssel is well positioned to help customers to solve problems in the space of packaging and assembling the next generation of electronic devices. For more information, visit www.laserssel.com.
Laserssel Corporation is a leading provider of laser selective soldering technology supporting global semiconductor, automotive, consumer, communications, military and industrial segments. As a pioneer in selective soldering segments, Laserssel has provided customers with unique soldering capabilities to allow to solder on heat sensitive substrates that were considered to be impossible to reflow. Laserssel is now expanding its product offerings in advanced packaging, plastic and organic substrates, very thin substrates with concern of warpage and any other challenges that were difficult, if not impossible, in conventional reflow process.
