Jan 22, 2002 
Glenbrook Technologies Inc., a leading supplier of Real-time X-ray Inspection Systems to the electronic fabrication and assembly industries has announced the availability of several upgrades to their newly developed X-ray image processing software, GTI-5000. The latest version software (version 1.06) has been upgraded to run in a Windows XT, Windows 2000, or Windows NT environment and perform complex inspection routines required for leading-edge packaging technologies like TBGA's, Super BGA's, DSP's as well as CSP's and microBGA's. The software is fully network-able, allowing multiple users to share both image and data files. The GTI-5000 package facilitates real-time image processing of X-ray images, reduces noise, and sharpens the image.
The most recent version of GTI-5000 software is capable performing two new, extremely useful functions, not previously available. The "Quick Image Save" function permits rapid file-naming and image storage, without the need to keystroke unique file names, allowing greater operator productivity during live x-ray sessions. A new, 3D Rendering tool adds enhanced dimension and color to 2D images by enhancing their grayscale values.
Additionally, GTI-5000 provides fast and accurate measurement of Percent Void, Drill Offset, Wire Sweep, Linear Distance, Traced Area and many other critical calculations. The graphic user interface (GUI) allows users to adjust image contrast, apply filters, zoom and pan the image, change screen views, annotate on images, and save images to a spreadsheet application. A complete On-screen Help utility is also included.
The GTI-5000 includes a PC with a 10/100PCI network card, imaging hardware to support RS-170 video, a 32MB AGP graphics card, an Intel PIII CPU with 667 MHz, and 128MB/133Mhz of SDRAM memory and a CD and floppy drive.
Glenbrook Technologies' proprietary X-ray inspection systems are used by electronics manufacturers and assemblers worldwide, in both laboratory and production settings to verify the integrity of hidden solder joints for BGA's as well as many other sophisticated electronic packaging technologies.
