May 12, 2020 
BTU International, Inc. is pleased to announce that Fred Dimock, manager of process technology, will participate in a live panel discussion on Tuesday, May 19, 2020. The discussion entitled, “Automation and Energy Conservation in the Reflow Process,” will be hosted by Global SMT & Packaging magazine.
Reflow ovens are one of the most expensive pieces of production equipment to run. They consume large amounts of electricity and in many cases nitrogen. This panel will discuss methods to reduce energy costs and optimize nitrogen consumption.
Dimock has taught numerous SMTA solder reflow classes and has participated in the 5-45 subcommittee for the development of IPC-7801 Reflow Oven Process Control Standard. He wrote the chapter on solder reflow for the ‘Handbook of Electronic Assembly’ and ‘A Guide to SMTA Certification’ by Dr. Lasky and Jim Hall.
Dimock holds an Associate’s Degree in Mechanical Design from Wentworth in Boston and a Bachelor’s Degree in Ceramic Engineering from the State University of New York at Alfred (SUNY). He has been recognized with a Distinguished Speaker status at SMTA Guadalajara and received several Best Vendor Presentation awards at the SMTA East China conferences.
For more information about BTU International, visit www.btu.com.
BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment in the electronics manufacturing market. BTU’s high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), diffusion, sintering and advanced solar cell processing. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available at www.btu.com.
