Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, co-authored Assembly and Reliability of Lead-Free Solder Joints with Dr. John H. Lau. The book is a new source on lead-free solder joints for advanced reliability across the complete food chain of electronics products.
The first edition of Assembly and Reliability of Lead-Free Solder, published by Springer, Singapore, is currently available in print and eBook forms. It explores both principles and engineering practices, and provides a comprehensive overview of electronics products—from electronic manufacturing services (EMS) on second-level interconnects, to packaging assembly on first-level interconnects, and the semiconductor backend on 3D IC integration interconnects.
Each chapter delves into a different topic relevant to the industry, including solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints.
To purchase a copy of Assembly and Reliability of Lead-Free Solder Joints, visit SpringerLink or Amazon. The book’s ISBNs are 978-981-15-3919-0 for print and 978-981-15-3920-6 for digital.
Dr. Lee has been with Indium Corporation since 1986. He has more than three decades of experience in the development of fluxes, alloys, and solder pastes for SMT industries. He has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermally conductive materials. Dr. Lee has been recognized by numerous industry organizations for his research, including SMTA, IEEE, and CPMT, and is an IEEE fellow. Dr. Lee has published articles in numerous industry publications and is frequently an invited speaker for presentations, seminars, keynote speeches, and short courses worldwide, many of which have been recognized with “Best of Conference” awards.
Dr. Lau has been the CTO of Unimicron in Taiwan since August 2019. Prior to that, he was a Senior Technical Advisor at ASM Pacific Technology in Hong Kong; a specialist of the Industrial Technology Research Institute in Taiwan, and a Senior Scientist/MTS at Hewlett-Packard Laboratory/Agilent in California. With more than 40 years of R&D and manufacturing experience, he has authored or coauthored more than 480 peer-reviewed technical publications, invented more than 30 issued or pending US patents, given more than 300 lectures/workshops/keynotes, and authored or coauthored 20 textbooks. He has received several awards and is an elected ASME fellow, IEEE fellow, and IMAPS fellow, and has been heavily involved in many of ASME’s, IEEE’s, and IMAPS’ technical activities.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email firstname.lastname@example.org. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.