SMT, PCB Electronics Industry News

TRI Introduces New AOI Solution at NEPCON Asia 2020

Jul 14, 2020

Test Research, Inc. (TRI) will join NEPCON Asia held at the Shenzhen Exhibition & Convention Center to feature Innovative SMT Inspection solutions for the Smart Factory. Visit booth #1C65 to experience Smart Factory Inspection Solutions in action.

TRI will unveil the 3D AOI TR7700Q SII with improved optical system that increases stability and increases speed up to 25%, compared to the last model. TRI will also showcase the high-resolution 3D AXI TR7600F3D SII with unprecedented speed.

Furthermore, TRI will be presenting the Multi-Angle 3D AOI TR7500QE offering higher quality imaging, and the Global Technology Award-winning 3D SPI TR7007Q, designed for Zero-Escape Industry Applications. Additionally, TRI will present the Multicore ICT TR5001Q SII Inline and the MDA TR518 SII Drawer with 2560 testing points.

Visit TRI's booth #1C65 at NEPCON Asia to discuss your Production Line requirements, and experience Smart Test and Inspection Solutions for the Connected Factory.


Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDA), In-Circuit Test equipment (ICT), and Functional Testing (FCT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, write to us at marketing@tri.com.tw or call +886-2-2832 8918.

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