Semiconductor and Advanced Packaging Inspection at SEMICON Taiwan 2020

Test Research, Inc. (TRI) is pleased to announce that it will be featuring Test and Inspection solutions for Semiconductor and Advanced Packaging Production Lines at SEMICON Taiwan 2020. Visit TRI at booth # J2534 to discover High-Precision Inspection for the Semiconductor Industry at Taipei Nangang Exhibition Center Hall 1.

Presenting an integrated solution for the PCBA production line, TRI will exhibit our Global Technology Award-winning TR7007Q 3D SPI solution. Furthermore, TRI will showcase the TR7700QE-S 3D AOI, designed for the Semiconductor & Advanced Packaging Industry, with an ultra-high-resolution at 3.45 μm. Powered by Metrology precision and flexible inspection algorithms, the TR7700QE-S can inspect and detect defects in wire bonds, die bonds, SMD, bumps, Wafer IC/Chip, underfill, and solder joints. Along with TRI's automated 3D CT X-Ray Inspection solution demo.

TRI's systems are designed to interoperate with other manufacturing equipment to minimize downtime, optimize production quality, and reduce operator workload. Our expert staff is ready to discuss our entire one-stop solution for ensuring PCBA production quality in a smart factory manufacturing environment.

TRI offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzer (MDA) and In-Circuit Test (ICT) equipment, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at marketing@tri.com.tw or call +886-2-2832 8918.