Nov 09, 2020 
SHENMAO America, Inc. is pleased to introduce its newly developed Joint-Enhanced FluxSMEF-Z3. The new no-clean flux has been designed for fine-pitch assembly and LED die attach.
SMEF-Z3 is compatible with solder paste; the flux can be applied after solder paste printing and cured simultaneously during reflow process. The cured flux enhances solder joint reliability. It can be used for pin-transfer and stencil printing processes.
SHENMAO is unique in the research and development of solder materials in Taiwan.
With the global trend of lead-free development, SHENMAO established the ADVANCED MATERIALS DEVELOPMENT CENTER in Taiwan. The company cooperates with the Industrial Technology Research Institute (Taiwan), Electronics Assembly and IC-packaging manufacturers.
SHENMAO has successfully been approved by many international well-known electronic manufacturers. The company strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. SHENMAO America, Inc. blends SMT solder paste at its facility in San Jose, CA for distribution in North America.
For more information, please visit www.shenmao.com.
SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.
