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TRI to showcase AI-powered Inspection Solutions at NEPCON China 2021

Mar 30, 2021

Test Research, Inc. (TRI) will join NEPCON China held at Shanghai World Expo Exhibition & Convention Center from April 21 – 23, 2021 to feature Innovative SMT Inspection solutions for the Smart Factories. Visit booth #1J40 to experience Smart Factory Inspection Solutions in action.

Join TRI at NEPCON China 2021 to discover the new "AI Station" capable of 24/7 inspection optimization using deep learning, reducing human errors, false calls, and operator costs. 

TRI will be showcasing the newly released 3D SPI TR7007Q Plus. The new 3D SPI is equipped with an improved motion controller and enhanced 2D lighting for sharper inspection images. Also exhibiting will be the AI-powered 3D AOI TR7700Q SII with unprecedented 1μm Resolution for High Accuracy, industry-leading speed of up to 57cm2/sec, and flexible algorithms.TRI's lineup will also include the high-end 3D AXI TR7600F3D SIIand the Multi-core ICT TR5001Q SII INLINE.

Realize your production line's potential with TRI's PCBA Test and Inspection solutions and Industry 4.0 data-driven management system, YMS 4.0. TRI's systems are designed to interoperate with other manufacturing equipment to minimize downtime, optimize production quality, and reduce operator workload.


Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Solder Paste Inspection (SPI), Automated Optical Inspection (AOI), and 3D Automated X-ray Inspection (AXI) systems to Manufacturing Defect Analyzers (MDAs), In-Circuit Test equipment (ICT), and Functional Testing (FCT), TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw.For sales and service information, write to us at marketing@tri.com.tw or call +886-2-2832 8918.

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