Nov 12, 2021 
Circuit Technology Center announces it has released an updated version of its popular Bonding System.
The Bonding System is specifically designed to bond replacement circuit patterns such as surface mount pads, BGA pads, and plated hole pads, to circuit boards. The Bonding System uses bonding tips to deliver a precise, calibrated pressure to activate and cure the dry film adhesive that is applied to the replacement circuit patterns. The system has a built-in calibration gauge to maintain a regulated bonding force and adjustable temperature control to maintain a uniform temperature throughout the 30-second replacement circuit bonding cycle. The Bonding System is also available with an optional stereo zoom microscope.
More information on the Bonding System can be viewed here: https://www.circuitmedic.com/products/115-4300.html.
Circuit Technology Center, founded in 1979, continues to be recognized as the most innovative and reliable specialist in circuit board damage repair, rework, BGA re-balling and component level modification services in the world.
For more information, please visit: www.circuitrework.com. Phone: 978-374-5000, Fax: 978-372-5700, Web: www.circuitrework.com.
