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Indium Corporation¬ Receives EM World's Innovation Award for Jetting, Microdispensing Paste

Jul 31, 2022

Indium Corporation earned Electronics Manufacturing (EM) World's Innovation Award for Indium12.8HF, a versatile solder paste engineered to deliver exceptional jetting and microdispensing performance on a variety of systems.

The EM Innovation Award program recognizes and celebrates excellence in the electronics industry, encouraging companies to achieve the highest standards and push the industry forward.

“We are honored to have Indium12.8HF recognized by EM World,” said Evan Griffith, product specialist. “As miniaturization continues its spread throughout all corners of the industry, more applications must adapt to finer pitches and smaller packages with paste deposits which may be unachievable by stencil printing. It’s critical to Indium Corporation that we produce innovative, proven products that provide solutions to the current and emerging challenges.”

Indium12.8HF is a no-clean, halogen-free solder paste that is inherently compatible with Indium Corporation’s best-selling solder paste—Indium8.9HF—and is optimized for long-term jetting and microdispense applications. Indium12.8HF has proven to be useful in a wide range of applications, including MEMS and MiniLED assembly, which require precision dot diameter/line width deposits down to 80μm, as well as offering consistent, reliable dispensability without skips through a day of use.

Additionally, Indium12.8HF:

  • Meets IPC J-STD-004B with Amendment 1 ROL0 requirements
  • Offers exceptional electrical reliability
  • Minimizes graping and similar reflow issues with a unique flux oxidation barrier formulation
  • Delivers aesthetically pleasing clear residue with minimal flow-out
  • Provides minimal reflow spatter compared to similar solder pastes
  • Has a long working (syringe) life

To learn more about Indium12.8HF jetting and microdispensing solder paste, visit www.indium.com/jetting-paste.


Indium Corporation® is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.


EM World provides the latest information in the industry for professionals engaged in PCB component design, assembly, and testing in Asia; it has also become a contract manufacturer (EMS/ODM) and an OEM company and provides them with equipment, materials, and software. It is considered the authoritative magazine to learn about the latest development trends for SMT, electronic packaging, and interconnection technology with the overall solution supplier/agent.

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