SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • A New Era of Mobility: Heraeus Electronics Launches New Innolot® 2.0 Solder Paste

A New Era of Mobility: Heraeus Electronics Launches New Innolot® 2.0 Solder Paste

Feb 27, 2023

Heraeus Electronics is pleased to announce the release of its new Microbond® SMT660 Innolot® 2.0 no-clean printing T4 solder paste. The new high reliability, high performance solder paste provides a competitive TCO offering. Based on Heraeus Electronics’ proven experience, Innolot 2.0 allows a wide process window, enabling soldering in air with a low defect rate. Additionally, it is designed to offer an optimized formulation for lower costs.

The requirements for mobility are changing worldwide. Electrification and automation of vehicles lead to high demand for cost- and performance-efficient materials. These are required to meet the increasing need for safety and support systems such as advanced driver assistance systems, increasingly intelligent control units, as well as in-car entertainment systems. The increasing demand is accompanied by harsher requirements for components and materials as well as TCO challenges.

With its new approach through Microbond® SMT660 Innolot® 2.0 for highly reliable and cost-effective solder alloys for automotive applications, Heraeus Electronics introduces the ability to maintain a competitive Total-Cost-of-Ownership, while fulfilling emerging requirements. The next generation of Innolot® alloy offers reduced cost while maintaining the well-known features of higher creep resistance, resulting in longer product life cycles at higher operating temperatures. The Microbond® SMT660 Innolot® 2.0 solder paste performs in the air without additional N2 during reflow, while keeping defect rates low, reducing your TCO.

The flux Microbond® SMT660 uses an acrylic based synthetic resin eliminating potential batch-to-batch variations when using natural raw materials. Due to its low impurities and the flux design, a high SIR performance is achieved. As a result, SMT 660 reduces the risk for electrochemical migration. The combination of the flux with Innolot® or Innolot® 2.0 alloy delivers a solder paste with superior reliability – especially in miniaturized systems in the automotive industry.

To learn more about Heraeus Electronics, visit www.heraeus-electronics.com.


The Heraeus Group is a broadly diversified and globally leading family-owned technology company, headquartered in Hanau, Germany. The company’s roots go back to a family pharmacy started in 1660.Today, the Heraeus group includes businesses in the environmental, electronics, health and industrial applications sectors. Customers benefit from innovative technologies and solutions based on broad materials expertise and technological leadership.

In the 2021 financial year, the FORTUNE Global 500 listed group generated revenues of €29.5 billion (US$34.9 billion*) with approximately 16,200 employees in 40 countries. Heraeus is one of the top 10 family-owned companies in Germany and holds a leading position in its global markets.


Heraeus Electronics is a leading manufacturer of materials for the assembly and packaging of devices in the electronics industry. The company develops material solutions for the automotive, power electronics and advanced semiconductor packaging market and offers its customers a broad product portfolio - from materials and material systems to services.

Jun 24, 2024 -

Heraeus Electronics Joins EU-Funded Project FastLane to Accelerate Future of Sustainable Power Electronics

Jun 10, 2024 -

Heraeus Successfully Defends Patent for Metal Sintering

May 27, 2024 -

Heraeus Electronics to Debut New Silver Sinter Paste for Module Attach Applications at PCIM Europe

Apr 08, 2024 -

Heraeus Electronics, MacDermid Alpha Electronics Solutions and Henkel Win Patent Infringement Lawsuit Against Senju Group

Apr 03, 2024 -

Heraeus Electronics Hosts ALL2GaN Event Showcasing Advances in High-Efficiency Power Electronics

Mar 18, 2024 -

Don't Miss Heraeus Electronics' Award-Winning Innolot® 2.0 Solder Paste at APEX

Mar 11, 2024 -

Heraeus Printed Electronics and SUSS MicroTec Join Forces to Revolutionize High-Volume Semiconductor Manufacturing with Inkjet Technology

Feb 05, 2024 -

Heraeus Electronics Thick Film Expands Its Portfolio through Acquisition of PriElex Electronic Inks from Kayaku Advanced Materials

Nov 20, 2023 -

Heraeus Electronics Wins 2023 GLOBAL Technology Award for Solder Alloy Innovation

Oct 30, 2023 -

Heraeus Electronics Honored by 2023 Mexico Technology Awards for New Microbond® SMT660 Series

22 more news from Heraeus »

Aug 07, 2024 -

Blue Thunder Technologies Joins SMTA as Corporate Member to Enhance Electronics Industry Knowledge and Insight

Aug 07, 2024 -

Silicon Mountain Reports Remarkable Efficiency Gains Under Leadership of Operations Manager Eddie Garcia

Aug 07, 2024 -

EVS International is excited to announce that it will be exhibiting the EVS 500LF at two upcoming SMTA Expos

Aug 07, 2024 -

KYZEN to Feature Extensive Line of Metal Cleaning Chemistries at IMTS

Aug 07, 2024 -

Diana Radovan Joins IPC as New Sustainability Policy Director

Aug 07, 2024 -

Join ZESTRON's Upcoming Webinar, Optimizing Removal of Conformal Coating Residues: Efficient, Cost-effective, and Safe Methods

Aug 07, 2024 -

CalcuQuote to Showcase Material Supply Planning Solution at SMTA Long Island Expo & Tech Forum

Aug 07, 2024 -

Explore PEMTRON's Cutting-Edge Inspection Systems at the 2024 KPCA Show

Aug 07, 2024 -

Altus Helps to Enhance Nexperia's Production Capabilities with Essemtec Fox MFC

Aug 07, 2024 -

BTU International Announces Strategic Partnership with Repstronics to Enhance Presence in Mexico and Central America

See electronics manufacturing industry news »

A New Era of Mobility: Heraeus Electronics Launches New Innolot® 2.0 Solder Paste news release has been viewed 637 times

  • SMTnet
  • »
  • Industry News
  • »
  • A New Era of Mobility: Heraeus Electronics Launches New Innolot® 2.0 Solder Paste
Software for SMT

SMT spare parts - Qinyi Electronics