Jun 12, 2023 
HELLER joined the 97th CEIA China Electronics Intelligent Manufacturing Summit Forum convened in Wuhan, garnering substantial attention from industry insiders. The conference concentrated on a wide array of fields, including optoelectronic communication, military electronics, and EV automotive electronics. With an impressive turnout of nearly 500 industry colleagues, the event proved to be an invaluable platform for networking and knowledge exchange.
The event garnered strong support from the esteemed local special committee, which facilitated the gathering of nearly 40 senior executives. The event served as a magnet for industry elites, bringing together representatives from 46 renowned domestic and foreign brands who showcased their cutting-edge innovations.
During the meeting, Mr. Chen, the sales manager of HELLER, presented HELLER's product line. "While our Horizontal Reflow and Vacuum Reflow technologies have garnered widespread recognition from customers, HELLER also takes pride in our industry-leading expertise in other products such as Formic Acid Reflow and Curing ovens. By offering customized configurations of our products, we ensure that we can meet the soldering and curing requirements of diverse industries and use cases, tailored precisely to the needs of our valued customers."
During the break from the speech, the attending guests flocked to HELLER's booth and engaged in discussions with the team, resulting in a several preliminary agreements towards a cooperative partnership.
Heller Industries is the market leader in reflow oven technology and supplies solutions for electronics manufacturers and assemblers worldwide. For more information visit https://hellerindustries.com
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