Mar 11, 2024 
With just four weeks remaining until the highly anticipated IPC Apex Expo 2024, Solderstar, a leading supplier of temperature profiling equipment for soldering processes, is gearing up to unveil its latest innovations. From April 9th to 11th, at Booth 2538 in Anaheim, California, Solderstar will introduce the newly launched Reflow Shuttle with O2 measurement module. This product promises to redefine soldering process optimization, offering manufacturers unparalleled control and precision.
The Reflow Shuttle O2 stands as a ground-breaking advancement in soldering process verification. It represents the first tool to integrate real-time oxygen (O2) measurement in parts per million (ppm), vibration levels in three axes, vacuum reading, temperature profiles, and conveyor speed onto a single platform. This consolidation of critical parameters helps manufacturers make informed decisions and optimize their reflow soldering processes with accuracy.
"Reflow soldering demands precision and control," said Mark Stansfield, CEO of Solderstar. "The Reflow Shuttle with O2 measurement module delivers detailed insights into critical parameters, equipping manufacturers with the tools needed for informed decision-making and process optimization.
“By consolidating measurement systems onto a single, robust platform, we're providing manufacturers with the knowledge to enhance quality and efficiency in their soldering operations with a single pass through the machine. We look forward to demonstrating this innovative solution at IPC Apex Expo and highlighting how it can benefit attendees' manufacturing processes."
Precise control over O2 levels is paramount in electronics manufacturing, as it directly impacts solder joint quality. The Reflow Shuttle O2 enables detailed monitoring of oxygen levels within each zone, allowing manufacturers to quantify nitrogen consumption and detect process issues quickly.
The Reflow Shuttle O2, with its seamless integration into existing reflow ovens, minimizes downtime during verification procedures while boasting a user-friendly interface that simplifies data collection for operators, facilitating prompt adjustments in case of anomalies. Its versatile design, with a specially engineered battery pack and Smartlink connector ensures continuous verification across multiple production lines without interruption. Importantly, the module allows for zone-by-zone analysis of oxygen levels throughout the reflow process. This provides manufacturers with granular insight to monitor oxygen content precisely and detect nitrogen leaks, thereby optimizing nitrogen consumption and maintaining process quality.
In addition to the Reflow Shuttle with O2 measurement module, Solderstar will feature its zero set-up SLX thermal profiler at the booth. The innovative SLX thermal profiler is designed to capture and analyze temperature profiles in various soldering processes.
Recognized for its accuracy and compact design, the SLX offers comprehensive data capture capabilities, further enhancing process control and product quality. It automatically detects connected test adapters and intelligently auto-configures the information, eliminating the need for manual set-up and saving valuable time.
Attendees are invited to visit Booth 2538 at IPC Apex Expo 2024 in Anaheim, California, to see the Reflow Shuttle O2 measurement module in action and explore Solderstar’s latest profiling equipment for reflow, wave, vapor, and selective soldering, including the zero set-up SLX.
www.solderstar.com
Solderstar is a recognised technology leader in the design and manufacture of thermal profiling systems for electronic soldering processes.
With offices in UK, USA and a technical centre in Germany the company offers the most comprehensive range of process control support and solutions for electronic manufacturers.
Solderstar personnel have over 30 years of temperature profiling design experience, combined with in-depth industry and process knowledge, and a ‘can do’ attitude to product and process improvement.
When Solderstar launched its first product offerings, lead-free manufacturing was, for most in the industry, a dot on the horizon. For Solderstar, lead-free soldering was already upon us. It was recognised early-on that soldering within electronic assemblies was set to go through something of a revolution, with new thermal processes needing to be established and controlled like never before. It was seen that electronics manufacturers all over the world would need improved thermal profiling solutions capable of meeting the demands of the newly emerging thermal processes and advancement in soldering machines and ovens.
To respond to this, Solderstar developed class leading instrumentation and software that streamline the whole profiling process across reflow, wave, selective and vapour phase soldering processes. Solderstar has grown from strength to strength, completely dedicated from the outset to the needs of the electronic manufacturer. Solderstar is committed to excellence in design, customer support and product innovation.
today, Solderstar products undoubtedly have ‘raised the bar’ and will continue to set the standard through our commitment to continual improvement of our products, and our ability to combine powerful functionality with robustness, accuracy, and simplicity.
