Mar 18, 2024 
BTU International, Inc. is proud to announce its receipt of the prestigious CIRCUITS ASSEMBLY 2024 NPI (New Product Introduction) Award in the Soldering – Reflow category. The award-winning product, the Aurora Reflow Oven Platform, represents a significant breakthrough in reflow soldering technology.
Designed to meet the evolving demands of Industry 4.0, the Aurora platform leverages state-of-the-art process control technologies and the latest Wincon 8 software updates to deliver unparalleled thermal processing performance. With its unique factory-configurable heating and cooling zones, the Aurora platform offers unmatched flexibility, allowing manufacturers to tailor their reflow ovens to suit specific product and process requirements, whether it's accommodating heavy boards, adhering to slow cooling constraints, or optimizing throughput.
The Aurora 200N is the most advanced reflow oven with the longest heated length ever produced by BTU. This groundbreaking addition redefines industry standards for performance, flexibility, and innovation, setting a new benchmark for reflow soldering technology.
"We are honored to receive the 2024 NPI Award in recognition of our Aurora Reflow Oven Platform," said Rob DiMatteo, General Manager at BTU International, Inc. "At BTU, we are dedicated to providing our customers with cutting-edge solutions that empower them to thrive in an increasingly competitive market. We’re thankful to CIRCUITS ASSEMBLY for this recognition and to our valued customers for their continued trust and support." added DiMatteo.
Introduced in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.
To learn more visit www.btu.com.
BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment in the electronics manufacturing market. BTU’s high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), diffusion, and sintering. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available at www.btu.com.
