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SHENMAO Technology proudly announces the development of its new thermal fatigue-resistant solder paste, PF918-P250. Designed to meet high-reliability requirements, PF918-P250 offers advanced features and superior performance for electronic products requiring exceptional durability.
Features of PF918-P250:
- Halogen-free (ROL0): No halogen intentionally added, ensuring compliance with RoHS, RoHS 2.0, and REACH regulations.
- Excellent voiding performance: Minimizes void formation, enhancing solder joint integrity.
- Good printability: Ensures consistent and precise application in various manufacturing processes.
- New SHENMAO Alloy: Exhibits excellent thermal fatigue resistance, significantly improving reliability in thermal shock and thermal cycling tests.
PF918-P250 is formulated with high-strength solder material, designed for long-service life electronic products with stringent reliability requirements. This solder paste incorporates the newly designed high-reliability lead-free alloy PF918, which boasts a tensile strength performance 1.4 times greater than the typical SAC305 alloy.
Moreover, PF918 demonstrates superior thermal cycling reliability, making it ideal for automotive devices and high-power components with demanding thermal reliability needs. Board-level thermal cycling tests with real automotive IC products reveal that the thermal cycling life of PF918 is twice that of the SAC305 alloy.
For more information about PF918-P250 and other SHENMAO products, please visit www.shenmao.com.
SHENMAO is dedicated to the production of solder products including Water Soluble and No-clean Solder Paste, Laser Solder Paste, Solder Preforms, Cored Solder Wire, Wave Solder Bar Alloys, Wave Soldering Fluxes, Extremely Pure Solder Powder up to Type 8, BGA and Micro BGA Solder Sphere, Wafer Level Packaging Solder Paste and Fluxes, LED Die Attach Paste, High Performance Liquid Fluxes, Solder Preform, Solar Ribbon, Plating Anode used in PCB Fabrication, Assembly and Semiconductor Packaging Processes.
