Aug 12, 2024 
Solderstar, a leader in innovative profiling solutions for the electronics manufacturing industry, is exhibiting at the SMTA International 2024 conference in Rosemont, Illinois, booth 2838, from October 22-24. This prestigious event will provide Solderstar with a platform to connect with industry leaders and showcase their state-of-the-art Reflow Shuttle, which now features crucial oxygen (O2) measurement capabilities.
SMTA International is known for presenting the latest innovations, solutions, and expertise that are shaping the future of the electronics industry. Solderstar's exhibit will highlight their continued commitment to providing advanced solutions designed to enhance manufacturing processes.
The Reflow Shuttle has been a focal point of Solderstar’s recent trade show presentations. This comprehensive profiling solution now includes all five essential measurements required for precision in reflow soldering: O2 ppm, vibration levels in three axes, vacuum, temperature profiles, and conveyor speed.
Keith Blakeley, Solderstar Sales Manager, said: "O2 levels are crucial in the reflow process, as they can affect solder joint quality. High levels of O2 can lead to oxide formation, weakening the solder joint and increasing susceptibility to failure. Additionally, O2 can cause de-wetting, preventing a good bond with the PCB.
“By precisely measuring oxygen levels and maintaining them below critical thresholds, the Reflow Shuttle ensures strong and reliable solder joints, reduces solder wastage, and optimizes nitrogen usage. This comprehensive approach increases product quality and manufacturing efficiency, equipping manufacturers with real-time insights into their reflow soldering processes and enabling informed decision-making and operational optimization.
“We are looking forward to presenting the Reflow Shuttle O2 measurement module at SMTA International and demonstrating how our solutions can significantly improve manufacturing processes.”
To find out more, visit Solderstar at SMTA International, booth 2838, in Rosemont, IL, from October 22-24, 2024.
www.solderstar.com
Solderstar is a recognised technology leader in the design and manufacture of thermal profiling systems for electronic soldering processes.
With offices in UK, USA and a technical centre in Germany the company offers the most comprehensive range of process control support and solutions for electronic manufacturers.
Solderstar personnel have over 30 years of temperature profiling design experience, combined with in-depth industry and process knowledge, and a ‘can do’ attitude to product and process improvement.
When Solderstar launched its first product offerings, lead-free manufacturing was, for most in the industry, a dot on the horizon. For Solderstar, lead-free soldering was already upon us. It was recognised early-on that soldering within electronic assemblies was set to go through something of a revolution, with new thermal processes needing to be established and controlled like never before. It was seen that electronics manufacturers all over the world would need improved thermal profiling solutions capable of meeting the demands of the newly emerging thermal processes and advancement in soldering machines and ovens.
To respond to this, Solderstar developed class leading instrumentation and software that streamline the whole profiling process across reflow, wave, selective and vapour phase soldering processes. Solderstar has grown from strength to strength, completely dedicated from the outset to the needs of the electronic manufacturer. Solderstar is committed to excellence in design, customer support and product innovation.
Today, Solderstar products undoubtedly have ‘raised the bar’ and will continue to set the standard through our commitment to continual improvement of our products, and our ability to combine powerful functionality with robustness, accuracy, and simplicity.
