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Agilent SJ50 Series II and its Patent-pending Solid Shape Modeling

Apr 01, 2003

Automated Optical Inspection (AOI) brings tactical advantages to

electronics manufacturers with fast, automated, cost-effective inspection

early in the production and assembly process. AOI is flexible technology for

controlling processes and pinpointing board defects that are introduced

during paste printing, component placement and the solder process. It has

been proven to eliminate many of the common and costly defects that slip

into printed circuit boards (PCBs), generating significant cost reductions

downstream, especially at board repair.

The biggest breakthroughs in AOI are available today from Agilent.

The Agilent SJ50 Series II integrates key enabling technologies that allow a

degree of accuracy and flexibility not previously seen in AOI. Agilent�s AOI

offerings provide cost-effective access to the most advanced technologies in

AOI today.

Solid-shape modeling (patent-pending)

The Agilent SJ50 Series II is the world�s first AOI system to offer

Solid Shape Modeling technology, a true breakthrough in optical inspection.

The SJ50�s lighting head uses LEDs to project red/green/blue (RGB) light

from different angles onto the surface features of a PCBA. A single highspeed

high-resolution camera then acquires multiple images of the same

field of view, using the different angles and colors to build a solid-shape

model of components and solder joints. The result is a remarkably lifelike

three-dimensional view of devices and board features. (See Figure 1.)

Solid-shape modeling ensures industry-leading call accuracy along

with a companion decrease in mean time-to-repair: Agilent AOI systems

provide 3D images of defects, allowing repair technicians to verify defects

without a microscope. Rather than searching for the source of a defect call,

they get a precise repair recommendation from the Agilent system so they

can quickly confirm the defect and make the repair.

Benefits of Solid Shape Modeling include:

-Lifelike 3D image detail

-Industry-leading call accuracy and defect detection

-Faster repairs with repair recommendations

-Better information for process control

Agilent SJ50 Series II

The optical-based Agilent SJ50 works at multiple locations in the

SMT line including post-reflow solder joint inspection, pre-reflow

component location measurement, and post-paste 2D solder paste inspection.

It combines competitive pricing with features and capabilities that other AOI

systems cannot match:

-Call accuracy�revolutionary 3D Solid Shape Modeling delivers lifelike

images for the highest call accuracy, along with defect analysis and

recommendations to accelerate repair cycles.

-Platform flexibility�unified platform architecture with an

interchangeable lighting head allows an Agilent SJ50 to be converted into

an Agilent SP50 (3D paste inspection) system and back again.

-Simple programming�a Microsoft� Windows� 2000 interface,

interactive click-and-drag GUI, universal part programming, self-learning

algorithms, and two complete algorithm engines (another industry first)

for geometric pattern matching allow most users to generate programs in

an hour or less. Setup parameters are in clear terms and are easy to

understand.

-Localizable interface�Chinese-language interface is available to

simplify set-up, repairs and operation.

-Optical character recognition�included OCR software allows text on

components to be read and stored.

-High speed with high resolution�20-25um/pixel resolution at all times

with a single high-resolution digital camera and high-speed precision

gantry�no tradeoff between speed and resolution.

-Low repair costs�detailed measurement data shows where defects are

and where they are not, reducing mean time-to-repair.

-Tailored solutions�Agilent SJ50 Series II XL for large boards up to 24

inches (610 mm) square.

Unified platform

The Agilent SJ50 Series II and the Agilent SP50 solder-paste

inspection system share a unified platform that allows the systems to switch

functions quickly, providing industry-leading flexibility for inline AOI. The

3D paste inspection system can be turned into a pre- or post-reflow system,

and vice versa, by simply swapping the interchangeable lighting head. For

example, you can put an Agilent SP50 in your line for 100 percent 3D solder

paste inspection, then once the paste process is tuned, simply swap the head

and move the machine to a new location for post-reflow solder joint

inspection, pre-reflow component location measurement, or post-paste 2D

solder paste inspection. The head conversion can be performed at any time,

as often as needed, on-site, by in-house engineers. Only Agilent AOI

systems provide this capability.

The benefits:

-Exceptional flexibility for investment protection

-Increased return-on-assets (ROA) and return-on-investment (ROI)

-Less training for operators and maintenance engineers

Jana Knezovich, Agilent, Americas

+ 970 679-3399

jana_knezovich@agilent.com

Paul Guerrero, Agilent, Japan, Europe & Asia

+1 970 635-6013

paul_guerrero@agilent.com

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