electronics manufacturers with fast, automated, cost-effective inspection
early in the production and assembly process. AOI is flexible technology for
controlling processes and pinpointing board defects that are introduced
during paste printing, component placement and the solder process. It has
been proven to eliminate many of the common and costly defects that slip
into printed circuit boards (PCBs), generating significant cost reductions
downstream, especially at board repair.
The biggest breakthroughs in AOI are available today from Agilent.
The Agilent SJ50 Series II integrates key enabling technologies that allow a
degree of accuracy and flexibility not previously seen in AOI. Agilent�s AOI
offerings provide cost-effective access to the most advanced technologies in
Solid-shape modeling (patent-pending)
The Agilent SJ50 Series II is the world�s first AOI system to offer
Solid Shape Modeling technology, a true breakthrough in optical inspection.
The SJ50�s lighting head uses LEDs to project red/green/blue (RGB) light
from different angles onto the surface features of a PCBA. A single highspeed
high-resolution camera then acquires multiple images of the same
field of view, using the different angles and colors to build a solid-shape
model of components and solder joints. The result is a remarkably lifelike
three-dimensional view of devices and board features. (See Figure 1.)
Solid-shape modeling ensures industry-leading call accuracy along
with a companion decrease in mean time-to-repair: Agilent AOI systems
provide 3D images of defects, allowing repair technicians to verify defects
without a microscope. Rather than searching for the source of a defect call,
they get a precise repair recommendation from the Agilent system so they
can quickly confirm the defect and make the repair.
Benefits of Solid Shape Modeling include:
-Lifelike 3D image detail
-Industry-leading call accuracy and defect detection
-Faster repairs with repair recommendations
-Better information for process control
Agilent SJ50 Series II
The optical-based Agilent SJ50 works at multiple locations in the
SMT line including post-reflow solder joint inspection, pre-reflow
component location measurement, and post-paste 2D solder paste inspection.
It combines competitive pricing with features and capabilities that other AOI
systems cannot match:
-Call accuracy�revolutionary 3D Solid Shape Modeling delivers lifelike
images for the highest call accuracy, along with defect analysis and
recommendations to accelerate repair cycles.
-Platform flexibility�unified platform architecture with an
interchangeable lighting head allows an Agilent SJ50 to be converted into
an Agilent SP50 (3D paste inspection) system and back again.
-Simple programming�a Microsoft� Windows� 2000 interface,
interactive click-and-drag GUI, universal part programming, self-learning
algorithms, and two complete algorithm engines (another industry first)
for geometric pattern matching allow most users to generate programs in
an hour or less. Setup parameters are in clear terms and are easy to
-Localizable interface�Chinese-language interface is available to
simplify set-up, repairs and operation.
-Optical character recognition�included OCR software allows text on
components to be read and stored.
-High speed with high resolution�20-25um/pixel resolution at all times
with a single high-resolution digital camera and high-speed precision
gantry�no tradeoff between speed and resolution.
-Low repair costs�detailed measurement data shows where defects are
and where they are not, reducing mean time-to-repair.
-Tailored solutions�Agilent SJ50 Series II XL for large boards up to 24
inches (610 mm) square.
The Agilent SJ50 Series II and the Agilent SP50 solder-paste
inspection system share a unified platform that allows the systems to switch
functions quickly, providing industry-leading flexibility for inline AOI. The
3D paste inspection system can be turned into a pre- or post-reflow system,
and vice versa, by simply swapping the interchangeable lighting head. For
example, you can put an Agilent SP50 in your line for 100 percent 3D solder
paste inspection, then once the paste process is tuned, simply swap the head
and move the machine to a new location for post-reflow solder joint
inspection, pre-reflow component location measurement, or post-paste 2D
solder paste inspection. The head conversion can be performed at any time,
as often as needed, on-site, by in-house engineers. Only Agilent AOI
systems provide this capability.
-Exceptional flexibility for investment protection
-Increased return-on-assets (ROA) and return-on-investment (ROI)
-Less training for operators and maintenance engineers
Jana Knezovich, Agilent, Americas
+ 970 679-3399
Paul Guerrero, Agilent, Japan, Europe & Asia
+1 970 635-6013