SMTA Beantown Bonanza

and FLIP CHIP & BGA WORKSHOP

June 9-11, 2003

Bayside Convention Center

Boston, MA

SMTA BOSTON will provide you with all of the answers that you need to stay competitive in today's market. This comprehensive program will allow you to choose from full and half day courses, workshops, panel discussions and lectures. Develop a program of offerings to meet your own specific needs. There is something for everyone on June 9-11 in Boston.

For complete conference information and registration visit http://www.smta.org/education/academy/academy.cfm

The components of this year's event are:

SMTA ACADEMY

June 9-11

A series of full and half day courses covering:

7 T1 Solder Joint Reliability of Flip-Chip and Chip Scale Package Assemblies

7 T2 Ball Grid Array: Principles and Practice Including Rework

7 T3 Lead-Free Soldering in a Production Environment

7 T4 Lead-Free Solder Joint Reliability

7 T5 Troubleshooting the SMT Assembly Process

7 T6 Design for Manufacturability

7 T7 Surface Mount Technology Fundamentals

7 T8 Cost Estimating for Improved Profitability

7 T9 Troubleshooting Reflow Soldering For SMT and Area Array Packages

For complete conference information and registration visit http://www.smta.org/education/academy/academy.cfm

FLIP CHIP AND BGA PACKAGING TECHNOLOGIES WORKSHOP

June 10-11

The focus of the SMTA Flip Chip and BGA Technologies Workshop is to provide a forum for attendees to understand the fundamental aspects, current practices, and future trends in the rapidly advancing area of flip chip and BGA technologies.

Interconnect design, solder pastes, printing, underfill materials and practices, as well as reflow profiles are critical to the successful manufacture of flip chip and BGA assemblies. Area array interconnects also present a number of unique challenges towards achieving adequate solder joint reliability for products that are being placed in a growing variety of service environments.

Technical Conference Chair

Paul Vianco, Sandia National Labs

Committee Members

Dr. Jean-Paul Clech, EPSI, Inc.

Dr. Dan Baldwin, Siemens

SMTA VP of Technical Programs

Dr. Ken Gilleo, Cookson Performance Solutions

SPECIAL "FREE" EVENTS

June 11

AOI Panel Discussion- Panel Moderator: Phil Zarrow, ITM, Inc.

June 11

SMTA Annual Meeting

Presentation: "ET is Finally Pulling Us Upward", Ken Gilleo, Cookson Performance Solutions

For complete conference information and registration visit http://www.smta.org/education/academy/academy.cfm

SMTA