Apr 10, 2003 and FLIP CHIP & BGA WORKSHOP
June 9-11, 2003
Bayside Convention Center
Boston, MA
SMTA BOSTON will provide you with all of the answers that you need to stay competitive in today's market. This comprehensive program will allow you to choose from full and half day courses, workshops, panel discussions and lectures. Develop a program of offerings to meet your own specific needs. There is something for everyone on June 9-11 in Boston.
For complete conference information and registration visit http://www.smta.org/education/academy/academy.cfm
The components of this year's event are:
SMTA ACADEMY
June 9-11
A series of full and half day courses covering:
7 T1 Solder Joint Reliability of Flip-Chip and Chip Scale Package Assemblies
7 T2 Ball Grid Array: Principles and Practice Including Rework
7 T3 Lead-Free Soldering in a Production Environment
7 T4 Lead-Free Solder Joint Reliability
7 T5 Troubleshooting the SMT Assembly Process
7 T6 Design for Manufacturability
7 T7 Surface Mount Technology Fundamentals
7 T8 Cost Estimating for Improved Profitability
7 T9 Troubleshooting Reflow Soldering For SMT and Area Array Packages
For complete conference information and registration visit http://www.smta.org/education/academy/academy.cfm
FLIP CHIP AND BGA PACKAGING TECHNOLOGIES WORKSHOP
June 10-11
The focus of the SMTA Flip Chip and BGA Technologies Workshop is to provide a forum for attendees to understand the fundamental aspects, current practices, and future trends in the rapidly advancing area of flip chip and BGA technologies.
Interconnect design, solder pastes, printing, underfill materials and practices, as well as reflow profiles are critical to the successful manufacture of flip chip and BGA assemblies. Area array interconnects also present a number of unique challenges towards achieving adequate solder joint reliability for products that are being placed in a growing variety of service environments.
Technical Conference Chair
Paul Vianco, Sandia National Labs
Committee Members
Dr. Jean-Paul Clech, EPSI, Inc.
Dr. Dan Baldwin, Siemens
SMTA VP of Technical Programs
Dr. Ken Gilleo, Cookson Performance Solutions
SPECIAL "FREE" EVENTS
June 11
AOI Panel Discussion- Panel Moderator: Phil Zarrow, ITM, Inc.
June 11
SMTA Annual Meeting
Presentation: "ET is Finally Pulling Us Upward", Ken Gilleo, Cookson Performance Solutions
For complete conference information and registration visit http://www.smta.org/education/academy/academy.cfm
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