SMT, PCB Electronics Industry News

IPC and JEDEC Hold Third Annual Lead-Free Conference

Apr 10, 2003

NORTHBROOK, Ill., February 10, 2003--IPC-Association Connecting Electronics Industries� and JEDEC, the solid state technology association, announce the development of the 3rd Annual International Conference on Lead-Free Electronic Assemblies. The co-sponsored event will take place April 22-24, 2003 at The Fairmont Hotel in San Jose, Calif.

"This conference continues to support the position of IPC's Board of Directors on Lead Free electronics, which is to keep the industry informed of changing requirements and to encourage the voluntary elimination of lead," said David Bergman, IPC's vice president of standards, technology and international relations. "With the establishment of July 1, 2006, as a ban deadline in Europe, the time to act is now."

The International Conference on Lead-Free Electronic Assemblies will offer 30- to 45-minute time slots for papers and presentations in both forum or panel discussion formats. The Conference Chairmen, Bergman and Molex Director of Industry Standards Martin Freedman, are seeking papers and presentations pertaining to the following areas:

� Policy-European Lead Ban status

� Component issues

� Design issues

� Environmental health and safety effects and alternatives

� Material availability and toxicity issues

� PCB issues

� OEM/Consumer demands/voluntary elimination dates

� Recycling options

� Substitution-New commercially available alloys/conductive adhesives/ease of replacement

� Cost issues

� Reliability evaluations

� Roadblocks to implementation

� Finishes issues-Organic solder protectants, immersion tin, silver, electroless nickel, palladium, etc.

Presentation materials and papers should be noncommercial in nature, focusing on technology. To deliver an oral presentation, it is mandatory to provide a print-quality paper or hard copies of visuals for the conference proceedings. Previously published papers and papers focused on a company's products will not be accepted.

Abstracts summarizing original and previously unpublished work and covering case histories, research and discoveries must be received by February 17, 2003. The abstracts should be approximately 200-300 words long and include a brief biography. If an abstract is accepted, the deadline for paper submissions will be March 31, 2003.

IPC and JEDEC also invite PCB suppliers to showcase their new products and services at the conference. For more information about reserving tabletop exhibit space, contact Alexandra Curtis, IPC's continuing education manager, at or 847-790-5377.

For more information about the conference, visit, contact Bergman at or 847-790-5340, or contact Ingrid M. Taylor, JEDEC's director of international programs, at or 703-907-7563.


JEDEC is the world's leading standards development organization for the semiconductor industry. Eighteen hundred representatives of some 275-member companies actively participate on 50 committees, developing standards to meet the needs of every segment of the industry. JEDEC is a founding sector of the Electronic Industries Alliance (EIA) that represents 2,100 companies in all areas of the electronics industry. For more information about JEDEC, visit

About IPC

IPC is a Northbrook, Ill.-based trade association dedicated to the competitive excellence and financial success of its more than 2,400 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of a $44 billion U.S. industry employing more than 400,000 people. IPC maintains offices in Taos, N.M.; Washington, D.C.; Garden Grove, Calif.; and Shanghai, China. For more information, visit

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