May 06, 2003 lead-free technology, a special symposium on Thursday during SMTA
International (September 21-25 at Donald Stephens Convention Center in
Rosemont, IL) will be dedicated to examining the current progress of
Lead-free technology. Organized by Dr. Paul T. Vianco, Sandia National
Labs, the Lead-free Soldering Symposium will address key issues in the
implementation and reliability of electronics assembled with Lead-free solder.
Four paper sessions will address Lead-free and Tin Whiskers Consortia
Activities, Solder Materials, Process Optimization for Lead-free Solder and
Conductive Epoxy, and Lead-free Soldering Reliability Studies.
During the session on Consortia Activities, representatives from the NEMI
Lead-free project, NEMI Tin Whiskers project, the High Density Packaging
Users Group (HDPUG), and the Joint Group-Pollution Prevention project will
describe their respective programs. These consortia represent partners
having business interests that range from low-cost, consumer electronics to
high-reliability, military products.
During the other sessions, speakers will discuss such topics as surface
finishes, component finishes, interface properties, high temperature
reflow, reflow atmosphere, solder paste formulation, the curing profile for
conductive epoxy attachment, and solder joint reliability, including solder
joint resistance to dynamic mechanical shock, accelerated thermal cycling
and thermal cycling data for avionics hardware.
For full details on the events during SMTA International, visit the on-line
conference brochure at smta.org/smtai or contact SMTA administrator JoAnn
Stromberg: 952-920-7682 or joann@smta.org.
The SMTA membership is a network of professionals who build skills, share
practical experience and develop solutions in electronic assembly
technologies and related business operations.
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