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IPC Solder Products Value Council, Solectron, Flextronics and U.S. NAVSEA Begin Reliability Test Program on Lead-Free Solder

Jun 11, 2003

NORTHBROOK, Ill., June 10, 2003--IPC�Association Connecting Electronics Industries� announced today that its Solder Products Value Council (SPVC) has begun a comprehensive study of the three leading lead-free alloys (Tin-Silver-Copper) in an effort to analyze the properties of the leading candidates for lead-free assembly.

The research will cover assembly performance and basic materials properties, such as wetting, phase structure of the materials, thermal shock performance, long-term thermal cycling behavior and solder joint reliability.

�This research on lead-free solder will provide significant value to the electronics industry, as companies transition to lead-free assemblies to meet emerging global requirements that ban lead from electronics products,� explained Peter Palmer, vice president of Global Marketing at Cookson Electronic Materials and chairman of the IPC SPVC. �I am delighted with the comprehensive scope of the research, the dedication of the members of the council and the contribution of our research partners. This program is a great example of what an industry can do when they work together.�

The IPC SPVC, which is funding the study, is made up of leading international solder materials suppliers, including AIM; Cookson Electronics Assembly Materials Group; Amtech, Inc.; Avantec Performance Chemicals, Electronic Business Unit; EFD, Inc.; Henkel Loctite; Indium Corporation; Kester Northrop Grumman; Nihon Superior Company Ltd.; P. Kay Metal Supply Inc.; Qualitek Group of Companies; Senju Metal Industry and Thai Solder Industry Corporation.

The IPC SPVC Lead-Free Subcommittee, chaired by Karl Seelig, AIM, Inc., is organizing the test program. The study is also supported by two of the leading electronics manufacturing services companies, Flextronics and Solectron Corporation, who will provide test vehicle assembly. In addition, the NAVSEA Crane Division, Naval Surface Warfare Center will provide the long-term reliability testing and Engent will evaluate the solder prior to assembly.

A complete data analysis and white paper summary of the work is scheduled for completion in the first quarter of 2004, upon completion of the testing.

Furthermore, IPC announced that, once it is published, the data will not only be used by IPC�s Technical Committees, but it will also influence the standards of the International Electrotechnical Commission (IEC) Technical Committee TC 91��Electronics Assembly Technology.�

Dieter Bergman, IPC�s director of technology transfer, Dr. Greg Munie, Kester Solder, and Dr. Alan Rae, Cookson Electronics, will act as technical liaisons between IPC and IEC in the sharing of the technical information.

For more information about IPC�s Solder Products Value Council, contact Tony Hilvers, IPC vice president of Industry Programs, at AnthonyHilvers@ipc.org or

847-790-5337.

About IPC

IPC is a Northbrook, Ill.-based trade association dedicated to the competitive excellence and financial success of its more than 2,300 member companies, which represent all facets of the electronic interconnection industry, including design, printed circuit board manufacturing and electronics assembly. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of a $40 billion U.S. industry employing more than 350,000 people. IPC maintains offices in Taos, N.M.; Washington, D.C.; Garden Grove, Calif.; and Shanghai, China. For more information, visit http://www.ipc.org.

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