Jun 25, 2003
(Madison, AL � June 24, 2003)---Nextek, Inc., a niche market, technology driven company, focused on offering precision electronic and optoelectronic assembly and engineering services for customers with needs-driven, non-commodity products, has expanded its production operations to meet increasing customer demand. Additional state of the art automated surface mount assembly equipment has been installed to provide expanded capacity for advanced technology printed circuit assemblies utilizing BGA, CGA, and CSP packaging as well as standard SMT. The additional capacity, combined with the ability to handle to any type of surface mount package will assist the company in servicing all of its customers.
Additional dispense and ultraviolet cure equipment was also installed in the company�s Class 10,000 clean room to address the increasing demand for microelectronic and optoelectronic assembly of fiber optic transceivers and medical devices.
The Company provides product realization services to OEM�s employing advanced technology interconnect, process and material technologies, and specializing in New Product Introduction (NPI) and accelerating time-to-market.
For more information, visit http://www.nextekinc.com.
Contact:
Philip M. Yates
Nextek, Inc.
201 Next Technology Drive
Madison, AL 35758-9117
256-772-0400
256-772-0420
philip.yates@nextekinc.com
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