Northrop Grumman Names George Black President of Interconnect Technologies

SPRINGFIELD, Mo., June 25, 2003 -- Northrop Grumman Corporation (NYSE:NOC) has named George H. Black president of Interconnect Technologies, a unit of Northrop Grumman's Component Technologies sector, effective immediately. He reports to Frank Brandenberg, corporate vice president and president of Component Technologies, and replaces Robert J. Schutz, who has retired from the company.

Black, a 25-year electronics industry veteran, assumes leadership of one of the world's leading manufacturers of technology-driven electronic and electro-optical printed circuit boards and assemblies. He most recently served as vice president, international operations, for Interconnect Technologies.

"George is a talented and seasoned executive who possesses a thorough understanding of our business, our strategy and our potential," said Brandenberg. "George has distinguished himself as a strong manager with an uncompromising commitment to excellence. Under his leadership, Interconnect Technologies will be in capable hands, and we expect him to bring the same successes to the business that he has brought to Interconnect's international operations."

Brandenberg continued, "We will greatly miss Bob Schutz's leadership and market expertise. Over the past 27 years, he has lead the transformation of Interconnect Technologies into an organization that is recognized as an industry leader in the multilayer printed circuit board and assembly market. We wish Bob and his family the very best in retirement."

Black joined Interconnect Technologies in 1991 as vice president, international operations, with responsibility for all operations outside North America. Previously, he was with Teradyne Incorporated in international sales and marketing.

Black holds a bachelor's degree in Electrical Engineering from Herriott Watt University. He has completed executive studies at Harvard University and the Wharton School of the University of Pennsylvania.

Interconnect Technologies manufactures complex, technology-driven, high-performance electronic and electro-optical printed circuit boards and backpanel assemblies through cabinet-level assembly to the world's leaders in the electronics industry. Headquartered in Springfield, Mo., it has operations in Scotland, California, China and Malaysia.

Northrop Grumman's Component Technologies sector, headquartered in Iselin, N.J., is a world leader in the design, development and manufacture of high-performance electronic and optical components and materials to the telecommunications, networking, industrial, medical and military markets. Component Technologies includes Interconnect Technologies, Kester, Life Support, Poly-Scientific, Precision Products International and Winchester Electronics.

CONTACT: Linda Self

Northrop Grumman Component Technologies

(417) 829-5208

http://www.northropgrumman.com