SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Department of Defense Awards Endicott Interconnect Technologies, Inc. $49M Contract

Department of Defense Awards Endicott Interconnect Technologies, Inc. $49M Contract

May 30, 2007

Endicott Interconnect Technologies, Inc. today announced that the U.S. Department of Defense has awarded a $49M follow-on production contract that includes a $5M contract for research and development of electronics packaging technologies including printed circuit boards and substrates for the next generation of high productivity computing. EI has successfully met the stringent DoD qualification requirements for its PCB, module and processing blade production.

This contract serves as the first of a three phased, five year program, that utilizes EI as a DoD research arm for exploring new, high speed electronics technologies. Phase one includes system development and preliminary PCB and substrate design along with fabrication of test vehicles for evaluating alternative material sets.

Phase two and three will be addressed in follow-on awards that encompass modifications to existing facilities to accommodate next generation processing equipment for advanced technology, PCBs, substrates and assembly. EI anticipates this work will stimulate the recruitment of the next generation of scientists and engineers to produce and deliver these future technologies.

"We're committed to developing new processes, technologies and techniques that enable progress in the electronics industry. Our goal is not only to deliver the advanced technologies required for this program, but to provide leading edge R&D for future programs as well," commented Rajinder Rai, Vice President of Research & Development at EI. "This R&D collaboration provides early access to technical advancement that results in a competitive advantage and helps to solidify our long term relationship with this DoD customer."

"Continual investment in R&D is a leading contributor to economic growth and quality of life and is the foundation of our success and overall company strategy," said Voya Markovich, Senior Vice President and CTO at EI. "We recognize that the creativity and invention of our talented people is the cornerstone of our success and we are developing a new generation of packaging engineers and scientists in the U.S. to maintain our leadership in the global electronics packaging industry."

Dec 03, 2010 -

Endicott Interconnect Technologies, Inc. Introduces New LCP Laminate Product Offering

Jul 08, 2008 -

Endicott Interconnect Technologies, Inc. President & CEO James J. McNamara Jr. Receives 2008 Entrepreneur of the Year Award

Jun 19, 2008 -

Congressman Arcuri Visits Endicott Interconnect Technologies, Inc.

May 12, 2008 -

Frost & Sullivan Recognizes Endicott for Superior Market Growth, Buoyed by Consistent Innovation and High Client Satisfaction

May 12, 2008 -

Cutting-edge Microelectronics Manufacturing Research Center Opens at Endicott Interconnect Technologies, Inc.

Feb 19, 2008 -

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Feb 19, 2008 -

Endicott Interconnect Technologies, Inc. Achieves Platinum Award for United Way Contributions

Jan 16, 2008 -

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Jan 16, 2008 -

Endicott Interconnect Technologies, Inc. Strengthens Management Team with New CFO Appointment

Jan 16, 2008 -

Pinto Joins Endicott Interconnect Technologies, Inc. as VP of Human Resources

15 more news from i3 Electronics »

Sep 21, 2018 -

Z-AXIS Adds Two to Leadership Team

Sep 20, 2018 -

PACE to Sponsor IPC Hand Soldering Competition at What’s New in Electronics (WNIE) Show in UK on 25-26 September

Sep 20, 2018 -

PACE to Sponsor IPC Hand Soldering Competition at What’s New in Electronics (WNIE) Show in UK on 25-26 September

Sep 20, 2018 -

In the midst of change

Sep 20, 2018 -

Logic PD's Manufacturing Facilities Earn Updated Quality Certifications

Sep 19, 2018 -

VJ Electronix makes component counting more accurate – Visit us at SMTA International

Sep 19, 2018 -

Specialty Coating Systems Introduces New PrecisionCoat Automatic Quick Change at SMTAI

Sep 19, 2018 -

STI Sponsors SMTA International

Sep 19, 2018 -

Nordson Test & Inspection Announces AOI and X-ray Lineup for SMTAI

Sep 19, 2018 -

SMTA Welcomes New Board Members

See electronics manufacturing industry news »

Department of Defense Awards Endicott Interconnect Technologies, Inc. $49M Contract news release has been viewed 33 times

  • SMTnet
  • »
  • Industry News
  • »
  • Department of Defense Awards Endicott Interconnect Technologies, Inc. $49M Contract
3D solder paste inspection system

Reflow Oven