What's happening at FINETECH in 2008?
Mar 25, 2008
We will continue to be challenged by the market to bring our years of valuable process knowledge to complex rework on high-density boards. This is especially true in the small module and handheld product markets. We will continue to deliver complete rework solutions for challenging rework such as fine pitch component printing, QFN, Package on Package, CSP/BGA reballing, and rework of under-filled components.
