All three models in the platform now boast industry leading machine accuracy and repeatability, including the Horizon 01i topping the list with a 2.0 Cpk @ +/- 25 microns. Extending the performance documentation even further, DPMO statistics are also available.
Functionality and shop floor productivity have been increased with the addition and extension of understencil cleaning and print verification technologies on other models in the range. Cyclone DEK�s multi-award-winning understencil cleaning technology, is now available on the Horizon 03i. Cyclone is a breakthrough high-speed understencil cleaning technology that substantially boosts cleaning speed and efficiency. But in addition to shorter cleaning times, Cyclone also delivers a significant throughput advantage, combining longer intervals between paper roll changeovers with reduced changeover times. The time and cost saving this represents extends manufacturing productivity beyond traditional expectations � a development which is further complemented by a significant reduction in required paper volume.
The entire Horizon platform range is now available with HawkEyeTM, DEK�s premier post print verification technology. HawkEye introduces a new inspection philosophy which isolates faults through rapid good/bad verification instead of performing excessively data-rich inspection during high-speed manufacturing. Unlike other systems, HawkEye can verify 100% of printed boards within the line beat rate by analyzing streamed images as opposed to successive still images. Depending upon the model, image acquisition speeds range from 750 square mm per second up to 1700 square mm per second.
Changes to the Horizon 03i also address operator ergonomics and enable lightning fast internal access to the machine with the incorporation of DEK�s popular gull wing panel design system and swing arm mounted, trackball operated graphical user interface with flat panel LCD.
About DEK
DEK is a global provider of advanced materials deposition technologies and support solutions including printing equipment platforms, stencils, precision screens and mass imaging processes used across a wide range of applications in electronics pre-placement subassembly, semiconductor wafer manufacture, and alternative energy component production. For more information, visit DEK at http://www.dek.com