SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • 2009 International Wafer-Level Packaging Conference Dates and Location Announced

2009 International Wafer-Level Packaging Conference Dates and Location Announced

Dec 06, 2008

Minneapolis, MN � The SMTA and Chip Scale Review Magazine are pleased to announce the dates for the 2009 International Wafer-Level Packaging Conference. The 6th annual offering of the IWLPC will be held on October 27-30, 2009 at the Santa Clara Marriott in Santa Clara, California.

The IWLPC has been held at the Wyndham San Jose for the past three years and is moving to Santa Clara to accommodate the growing program. Attendees will benefit from an additional conference track and increased space for the tabletop exhibition.

�The move to the Santa Clara Marriott is exciting for the IWLPC. The program continues to expand and interest from the industry rises each year. The new facility will be able to accommodate the additional conference track and thus help us increase the value of the program,� said Ken Gilleo, General Chair of the IWLPC.

The IWLPC will have two days of half-day tutorials led by leading instructors in the industry, followed by two days containing three tracks of technical presentations on wafer-level packaging technologies, 3D and Advanced Packaging and a tabletop exhibition.

Visit http://www.iwlpc.com for more information on the 2009 program

The IWLPC is coordinated by the SMTA and Chip Scale Review magazine.

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Dec 26, 2022 -

Wafer-Level Packaging Symposium (WLPS) Program Announced and Registration Now Open

Dec 14, 2022 -

Pan Pacific Microelectronics Symposium Program Finalized

Dec 07, 2022 -

International Counterfeit Electronics & Materials Symposium and Workshop 14th & 15th of March 2023

Oct 28, 2022 -

Keynote to Address Electric Vehicle Charging Infrastructure at SMTA International

Oct 20, 2022 -

2022 Stromberg Student Leader Scholarship Recipient Announced

Oct 20, 2022 -

Women's Leadership Program to Host Speed Mentoring during SMTA International 2022

Oct 20, 2022 -

2022 Charles Hutchins Educational Grant Winner Announced

Oct 06, 2022 -

Women's Leadership Program Presentation to Discuss Growth, Leadership and Self-Actualization during SMTA International 2022

Sep 30, 2022 -

Find out Why It Is Important to Change the Perception of Manufacturing at the Women's Leadership Program during SMTA International 2022

Sep 26, 2022 -

Women's Leadership Program to Discuss the Importance of Lifelong Learning during SMTA International 2022

702 more news from Surface Mount Technology Association (SMTA) »

Jan 27, 2023 -

New Functions Increase Cost-Efficiency and Energy-Efficiency in Wave Soldering Processes

Jan 27, 2023 -

Semi-auto Taping Machine HJC-1000

Jan 25, 2023 -

Retronix Turns to Gen3 Again for High Quality PCB Cleaning Requirements

Jan 23, 2023 -

IPC Debuts First Issue of IPC Community at IPC APEX EXPO 2023

Jan 23, 2023 -

IPC Education Foundation Announces New Website Launch

Jan 23, 2023 -

KYZEN Celebrates Its Leaping Water's Sweet Sixteen at APEX 2023

Jan 23, 2023 -

Heraeus Electronics provides latest materials portfolio for next-generation power electronics and semiconductor advanced packaging at NEPCON Japan 2023

Jan 23, 2023 -

StenTech Opens New Facility in Philadelphia

Jan 23, 2023 -

Inovaxe announces expansion into new facility in Boca Raton, Florida

Jan 23, 2023 -

MIRTEC Reports 22.6% Increase in Sales Revenue for 2022

See electronics manufacturing industry news »

2009 International Wafer-Level Packaging Conference Dates and Location Announced news release has been viewed 457 times

  • SMTnet
  • »
  • Industry News
  • »
  • 2009 International Wafer-Level Packaging Conference Dates and Location Announced
SMT Feeders

Reflow Oven