Seika Machinery's product offerings range from quality assurance products to SMT and automated test equipment:
Quality assurance products include the McDry Ultra-Low Humidity Storage Cabinet and Sawa Ultrasonic Stencil Cleaners. The McDry Ultra-Low Humidity Storage Cabinet dehumidifies ICs to prevent micro-cracking. The cabinets feature an ESD-safe design and conform to IPC/JEDEC J-STD 033B.1. Micro-cracking can cause corrosion, breaking of wires and several other problems but can be prevented with McDry humidity-controlled storage cabinets. Use of a dry cabinet is a viable alternative to baking, MBBs and nitrogen storage, and may be more efficient.
Sawa Stencil Cleaners are widely used in the Japanese electronics industry to ensure high yields when screen printing solder paste onto printed circuit boards. Normal cloth wipe cleaning of stencils cannot completely remove solder paste especially in fine-pitch applications because a small amount of solder balls have a tendency to adhere in the corners of the apertures. Sawa Stencil Cleaners are able to completely remove solder paste using ultrasonic vibration and require no special solvents because they work effectively with isopropyl alcohol, water-based solvents or any other solvent.
SMT products include the Furukawa Lead-Free Reflow Ovens, Sayaka PCB router and Young Jin Material Handling System. The Furukawa Lead-Free Reflow Ovens feature a superior thermal transfer ratio, reduced running costs and low nitrogen consumption. These ovens provide component temperature control with top and bottom differential heating. The ovens also feature high heating capacity along with quick set-up times. Furukawa reflow ovens provide easy maintenance with an advanced flux recovery system.
There is no better way to depanel a printed circuit board than with the Sayaka PCB Router. The high-speed router bit precisely cuts densely populated PCBs without stressing the board. Advanced image-processing software offers point and click operation for programming router paths easily and quickly. Automatic alignment compensation by CCD camera and extended router bit life are other features available.
Young Jin FA features a SMEMA interface with a slim, round design. The system provides decreased PCM stress through the use of a shock absorber. Safety features include a buzzer alarm function, safe tuning system by dual cylinder, and the cover design is safe from dust and mote.
Automated test equipment includes HIOKI in-circuit testers, the ANRITSU solder paste inspection system and the Hirox Digital Microscope System. HIOKI in-circuit testers are guaranteed to be fast and efficient with Seika's flying probe tester. The flying probe ICT has a variety of benefits that conventional testing machinery does not, including jig-less inspection for quick set up and the proficient testing of mismounted components, faulty components, and poor contacts. Through resistance testing, the flying probe tester is able to assess solder joints promptly while thwarting board damage through use of the soft-landing feature. The AOI function built-in to the flying probe tester is much more reliable than visual inspection, and will analyze the component's displacement, presence and polarity.
The Anritsu Solder Paste Inspection System allows 3-D high precision laser in-line inspection with ultra-high resolution. The system features high-speed inspection, along with easy programming and maintenance. Program generation takes only five minutes and results are consistent, regardless of operator. An automatic calibration function allows for easy maintenance and SPC software is included standard for detailed analysis and traceability.
The Hirox Digital Microscope System inspects objects dynamically in 360� with a patented Hirox design. The system's superior BGA inspection is capable of up to 200X magnification. Low maintenance costs are achieved with the use of a spring loaded lens tip to protect samples. The microscope system is highly configurable, offers a flexible lineup of lenses and peripheral devices, and optimal illumination is achieved using a metal halide lamp for balanced color spectrum.
Seika Machinery also will have information available about Nihon Superior Ltd. Co.'s SN100C, which is a lead-free alloy of tin, copper, nickel and germanium. Its unique properties make it possible to achieve high productivity in soldering processes to produce cost effectively reliable joints. Special features include high fluidity, low copper erosion, low drossing, superior wetting and freedom from shrinkage defects. The number of companies using SN100C has grown dramatically since its first application in 1999 in the soldering of VCR boards.
About Seika Machinery, Inc.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.