Designed for use in state-of-the-art SIPLACE X-Series placement machines, the SIPLACE MultiStar with CPP technology (Collect & Pick & Place) opens the door to a world of even more flexible and powerful line and placement concepts.
SIPLACE MultiStar CPP head ensures optimally balanced production lines
Mar 19, 2009
The new MultiStar CPP head makes it easy to optimally balance SMT lines and adapt them to new products � without having to switch heads, change setups or replace the line modules.
With its SIPLACE MultiStar, Siemens Electronics Assembly Systems presents the world's first placement head that automatically adapts to nearly all requirements and products in electronics manufacturing. By using different placement modes, the SIPLACE MultiStar balances production lines automatically. It is the first head that combines the speed of Collect & Place operation for small components (01005 and larger) with the versatility of Pick & Place operation for larger components (up to 50 x 40 mm). In addition, the new SIPLACE MultiStar operates in Mixed mode, which combines these two previously incompatible modes in a single placement cycle.
