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Nihon Superior’s SN100C P600 D4 Paste Wins a 2009 Global Technology Award

Nov 11, 2009

OSAKA, JAPAN — November 2009 — Nihon Superior Co. Ltd. announces that it has been awarded a 2009 Global Technology Award in the category of Soldering Materials for its SN100C P600 D4 Solder Paste. The award was presented to the company during a Tuesday, November 10, 2009 ceremony that took place at the New Munich Trade Fair Center in Munich, Germany.

SN100C P600 is a halogen-free high-reliability no-clean lead-free solder paste that does not contain F, Cl, Br and I. Designed as a high-reliability solder paste for high-density assembly with stable printability, the paste provides excellent reflow with good wetting and minimum incidence of mid-chip balling, and low residue. Additionally, it typically can be reflowed with a profile similar to that which is commonly used with SAC305 and SAC405 with 240°C peak.

Premiering in 2005, the Global Technology Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.

About Nihon Superior Co. Ltd.

Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries and formed business partnerships with companies in other markets.

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