Feb 08, 2010 
The HIOKI flying probe provides a variety of benefits over conventional testing machinery. Some of these benefits include jig-less inspection for quick set up, and the proficient testing of mis-mounted components, faulty components, and poor contacts. Through resistance testing, the flying probe test is able to assess solder joints promptly, while still thwarting board damage through use of the soft-landing feature.
With the HIOKI four-terminal solder joint integrity testing flying probes, which no offer system offers, the tiniest differences between inadequate and high-quality soldering can be identified.
A flying probe test can be carried out at such high speeds as a maximum cycle time of 0.05 seconds per step, with a probing pitch of 0.2 mm at a minimum.
The flying probe machinery also provides the option of automatic test generation so that users may distinguish between a faulty circuit performance and an accurate performance. Additionally, Seika provides the choice of computer-aided conversion software, making it even easier to analyze the data provided.
With its variety of measurement abilities for analyzing data and the high-quality speed of testing, the flying probe tester is a cost-effective way to efficiently and quickly assess any circuit board.
Product literature also will be distributed for all Seika Machinery’s products. For more information about the Hioki Flying Probe System or Seika’s full product line, visit Seika at the SMTA Upper Midwest Expo & Tech Forum or visit http://www.seikausa.com.
About Seika Machinery, Inc.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.
