Feb 23, 2010
Tin whiskers present a unique challenge to the electronics industry. There have been numbers of electronics failures in the market caused by tin whiskers since 1940s. After 2000, as a result of the global transition to lead-free electronics, the majority of the electronic component manufacturers are now using pure tin or tin-rich alloys for terminal and lead finishes. The increased used of tin based lead-free finishes and materials, focused concern and research on tin whiskers particular for long life and mission critical applications, such as space, aviation, and implantable medical devices.
A tin whisker is a conductive tin crystal, which can spontaneously grow from tin based lead-free finished surfaces even at room temperature, often in a needle-like form. Oxidation in humid atmosphere, corrosion, intermetallic formation, stress under thermal cycling, external pressure in fine pitch connectors and electromigration have been shown to promote whisker formation. However, acceleration models for whisker growth are very limited or not existent.
Listing of proceeding of prior International Symposia on Tin Whiskers can be found at http://www.calce.umd.edu/tin-whiskers/symposia.htm
This symposium presentation can cover case histories, theories of tin whisker growth, experiments and results, risk evaluation methods and risk mitigation strategies. Participants are provided free admission to the symposium.
Abstract are due by March 12th
Presentations are due June 4th
Symposium is June 23rd
An extra day may be added depending on number of submitted abstracts
Registration will open April 5th, Cost will be $300 for the one day event.
Organized by
Center for Advanced Life Cycle Engineering (CALCE)
The Institute of Scientific and Industrial Research (ISIR), Osaka University.
Contact
Dr. Michael Osterman, CALCE, University of Maryland, osterman@calce.umd.edu
Prof. Michael Pecht, CALCE, University of Maryland, pecht@calce.umd.edu
Dr. Katsuaki Suganuma, ISIR Osaka University, Japan, suganuma@sanken.osaka-u.ac.jp
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