Specific subject areas include, but are not limited to, the following:
- Semiconductor Technology
- Substrate Advancements
- Connectors and Interconnect Technology
- Lead-Free Implementation
- Tin Whiskers
- Corrosion
- Advancements in Materials
- Next Generation Harsh Environment Automotive Systems
- Solar Electronics
- Latest Developments in Thermal Cycle Testing for Extreme Environment Electronics
- Substrate Surface Finishes for Harsh Environment Applications
- Chemical, Thermal and Vibration Considerations for Industrial Electronics
- Reliability (HALT, ESS, HASS)
- Operating Environments for Military Electronics (land, sea, air and space)
Four of the six symposium sessions will require PRESENTATIONS ONLY. Speakers in these sessions will need to submit a powerpoint presentation for inclusion in the program proceedings. The remaining two sessions will require technical papers which will be included in the proceedings.
DEADLINE FOR ABSTRACTS: April 9, 2010