Universal’s GenesisSC: Semiconductor Performance at Surface Mount Speeds

Universal Instruments expands its proven Genesis Platform portfolio with the introduction of the GenesisSC Platform – a revolutionary Semiconductor solution that blends state-of-the-art flip chip assembly capabilities with the robustness and speed of the Genesis Platform.

The GenesisSC Platform has the inherent capability to provide a complete solution for any production environment. This platform has been tailored to place dies and passives precisely while promoting high yields and reliability at the lowest possible cost. "The combination of 300mm wafer capabilities and industry’s fastest flip chip throughput, along with Universal’s standing reputation for robustness, creates an industry-leading value for our customers", states Universal Marketing Director Heinz Dommel.

Because this new Semiconductor technology was developed from Universal’s base Genesis Platform, GenesisSC is able to leverage patented VRM (Variable Reluctance Motor) technology, which is the core of all Universal platforms. When coupled with Universal’s high-precision multi-spindle placement heads, it delivers a one-of-a-kind high-accuracy product offering with placement capabilities down to ±10 micron @ Cp>1. The GenesisSC Platform software has also been enhanced to feature greater ease of use to support Semiconductor applications.

"The higher-accuracy capabilities allow Universal to solve specialized packaging challenges" states Dommel. "By specifically targeting specialty areas such as System-in-Package (SiP), Flip Chip, and Flip Chip on Flex, GenesisSC provides the optimal solution to our customers." These specialized competencies do not come at the expense of flexibility, however, as GenesisSC maintains the Genesis lineage with a best-in-class component range from passives to SM devices.

Universal's unique peripherals further strengthen the complete, integrated Semiconductor solution. When combined with the Innova Direct Die Feeder, the new solution drastically reduces resource allocation and costs by directly presenting die from 300mm wafers to the platform machine without incurring costly packaging charges. The on-board Linear Thin Film Applicator (LTFA) provides dipping capabilities for paste or flux, as commonly associated with PQFN and Package-on-Package applications, and the 0.4 mil per pixel camera captures details of the most difficult substrate and fiducial types.