Jul 16, 2010 
According to the CPMT, “Dr. Lee has been a driving force in removing the ‘art’ of SMT assembly and replacing it with science. Ning-Cheng has identified and described numerous defect formation mechanisms, such as solder beading, slumping, swimming, solder robbing, voiding, head-in-pillow, and more. His elucidation of the fundamental elements of reactions occurring during the reflow process has corrected erroneous perceptions on reflow profiling held by the industry for over 20 years.”
The IEEE’s Components, Packaging, and Manufacturing Technology (CPMT) Society is the leading international forum for scientists and engineers engaged in the research, design, and development of revolutionary advances in microsystems packaging and manufacture. They sponsor a variety of awards to recognize outstanding contributions and technical achievements in the electronics industry.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership. Dr. Lee resides in Clinton, NY.
Indium Corporation is a premiere materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.
