Aug 17, 2010 
The Pan Pacific Microelectronics Symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems technology and assembly. The Program Committee invites you to submit your recent results for presentation at the Symposium on any of the topics listed below.
Papers should be 6-10 pages in length including graphics and they should offer original, previously unpublished, non-commercial research results on any of the topics listed below. Abstracts of 500 words should be submitted by August 16, 2010, with title and author contact information. Click the "Submit Abstract" button below to submit your abstract directly to the SMTA server, for review by the the Pan Pacific Technical Committee.
You will be notified by October 2010 if your abstract has been accepted and scheduled for presentation.
3D Technologies
- Package on Package (PoP)
- Thru Si Vias (TSV)
- Module Stacking
- Origami Flex Packages
- Shaped Circuits
- Build Up/Blind & Buried Via PWBs
- Cu Pillars & Posts
- Si Interposers
- MCM/SiP Advances
Lighting & Displays
- LED Packaging & Assembly
- Compact Fluorescent Systems
- OLED Developments
- Display Drivers
- Chip on Glass (CoG)
- MEMS/MOEMS
- Flat Panel Processes
Materials Advances
- Nano Materials Applications
- Thin & Thick Film Systems
- Pb & Halogen Free
- Thermal Management
- Phosphors & Light Absorption
- Interface Metallurgy (FC, WB, TAB, Pb Free Solder, etc.)
- Integrated Passive Devices
- Embedded Approaches (Passive & Actives)
- Failure Analysis and Reliability
Renewable Energy Technologies
- Photovoltaics
- Power Control/Conversion/Distribution
- Green Manufacturing
- Power Packaging
- Environmental Impact Analysis
- Solar Thermal Conversion
- Large Area/Module Assembly
Strategic Direction
- Supply Chain & Operations Management
- Economics & Cost Analysis
- Trends, Forecasts & Roadmaps
- Penetration Strategies
- Technology Drivers
- Health & Prognostics
- Manufacturing Management & Control
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