SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Finetech to Highlight Compact Rework System FINEPLACER® core at GEM Expo 2010

Finetech to Highlight Compact Rework System FINEPLACER® core at GEM Expo 2010

Sep 08, 2010

FINEPLACER® core rework system.

FINEPLACER® core rework system.

Finetech will highlight the new FINEPLACER® core rework system in distributor SMAtech Brazil‘s booth #317 at the upcoming GEM Expo 2010, scheduled to take place October 5-7, 2010 at the prestigious, state-of-the-art Expo Center Norte in São Paulo, Brazil.

The FINEPLACER® core offers proven rework technology for a wide spectrum of SMT components, ranging in size from 0201 to 50 x 50 mm BGAs, and handling PCBs up to 300 x 400 mm. The semi-automated design includes force measurement with automatic component lift off and placement. Based on key technology from Finetech‘s industry leading platforms, FINEPLACER® core represents a compact, yet versatile hot-gas rework system that will provide a level of professionalism exceeding its attractive price.

The system integrates the complete rework cycle into an efficient design, without diminishing functionality. Using the patented FINEPLACER® vision alignment system, FINEPLACER® core handles de-soldering, site dressing, paste print, re-balling and component replacement in one integrated platform. Driven by sophisticated integrated thermal management and the new QuickStart Profile Library, the new FINEPLACER® core provides more for less.

Finetech is a leading manufacturer of innovative rework and micro assembly equipment for the latest advanced packages. The modular design of the FINEPLACER® platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. Finetech is headquartered in Berlin, Germany, with offices in Tempe, Arizona; Manchester, New Hampshire; Shanghai, China; and Kuala Lumpur, Malaysia.

Jan 14, 2019 -

Finetech to Demo Contactless Residual Solder Removal at IPC APEX 2019

Apr 07, 2016 -

Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016

Nov 27, 2013 -

Martin Streamlines and Simplifies Rework with New Process Shuttle

Nov 08, 2013 -

Finetech Unveils High Force ACF Bonder

May 28, 2013 -

Al Cabral Joins Finetech as Regional Sales Manager

Mar 11, 2013 -

Donated Finetech Die Bonder Installed at Pennsylvania State University

Jan 16, 2013 -

Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO

Jan 04, 2013 -

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Oct 03, 2012 -

The Best in Rework Technology – Finetech to Exhibit FINEPLACER® Core Rework System at SMTA International

Sep 26, 2012 -

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

77 more news from Finetech »

Sep 20, 2024 -

VIBRO METER VM600 MPC4 200-510-070-113

Sep 20, 2024 -

Triconex CM3201 Digital input unit control card Module

Sep 20, 2024 -

WOODWARD 9907-186 Load Sharing Module

Sep 20, 2024 -

Triconex 3603T Digital Output

Sep 20, 2024 -

BENTLY NEVAD 330101-00-16-10-02-00

Sep 20, 2024 -

EPRO PR9268/201-000

Sep 20, 2024 -

ABB SPDSI13 Analog input module

Sep 20, 2024 -

HONEYWELL MU-TSIM12 51303932-426

Sep 20, 2024 -

Schneider 140CRA21220

Sep 20, 2024 -

PFEIFFER D-35614

See electronics manufacturing industry news »

Finetech to Highlight Compact Rework System FINEPLACER® core at GEM Expo 2010 news release has been viewed 1133 times

  • SMTnet
  • »
  • Industry News
  • »
  • Finetech to Highlight Compact Rework System FINEPLACER® core at GEM Expo 2010
High Precision Fluid Dispensers
High Resolution Fast Speed Industrial Cameras.
High Throughput Reflow Oven
Circuit Board, PCB Assembly & electronics manufacturing service provider

SMT spare parts - Qinyi Electronics