Sep 16, 2010 
RMA250 Solder Paste offers an excellent open time, extended abandon time and excellent soldering activity with all surface finishes. The paste is formulated for fast printing and meets or exceeds the requirements for ANSI/J-STD -004, -005 as well as all Bellcore test criteria for solder pastes.
The pin probable paste features excellent print volume consistency with surface area ratios (SAR) as low as 0.55 when used with the UltraSlic™ stencil technology. RMA250 has a low voiding/high reliability composition and a wide reflow window with excellent solderability on various PCB surface finishes. Additionally, post-process residues are clear and can be removed with a saponifier.
For more information about FCT Assembly’s RMA250 Solder Paste, visit http://www.fctassembly.com.
FCT Assembly consists of three divisions: FCT Solder, Fine Line Stencil, and A-Laser. With numerous facilities in the United States, we are one of the electronics industry’s leading manufacturers of lead-free and leaded solder products, superior quality stencils, and precision cut parts.
At FCT Assembly, we set ourselves apart from our competitors by continuously studying new products and processes in order to uphold our reputation as a leader in technology. Our customers can always count on FCT Assembly to use the latest technology and to supply products with the highest quality.
For more information, visit http://www.fctassembly.com
