SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • LatticeECP3 Device Is First Low Cost FPGA to Support Broadcom HiGigTM Protocol

LatticeECP3 Device Is First Low Cost FPGA to Support Broadcom HiGigTM Protocol

Nov 29, 2010

The LatticeECP3 family, is the third generation high value FPGA which offers the industry's lowest power consumption and price of any SERDES-capable FPGA device.

The LatticeECP3 family, is the third generation high value FPGA which offers the industry's lowest power consumption and price of any SERDES-capable FPGA device.

HILLSBORO, OR - Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the immediate availability of the HiGig™ MAC IP core for its award winning, low cost LatticeECP3™ FPGA family.

Enables Low Power Bridging and Switching Applications with Broadcom Devices

Multiple individual devices interconnected via the HiGig protocol operate as one logical network, seamlessly providing features like quality of service (QoS), mirroring and link aggregation. The HiGig MAC ensures that the Media Access rules specified in the 802.3ae IEEE standard and HiGig Protocol definitions are met while transmitting a frame of data over Ethernet. On the receive side, it extracts the different components of a frame and transfers them to higher applications through a FIFO interface. With this new Lattice IP core, designers will be able to implement low cost network solutions using Broadcom devices.

Compliant with Broadcom HiGig and HiGig2™ protocol definitions, the HiGig MAC IP core has a 64-bit wide internal data path operating at a maximum frequency of 156 MHz on the LatticeECP3 FPGA. The core provides XGMII and XAUI interfaces to the PHY layer and supports variable-sized packet transmission with fixed-sized messaging capability (HiGig2 only). With multicast address filtering and 16-bit statistics counters, the core requires approximately 4100 FPGA look-up tables (LUTs) for HiGig implementations and approximately 4700 FPGA LUTs for HiGig2 implementations.

"Broadcom continues to expand the vibrant HiGig ecosystem and we are pleased to welcome Lattice to the growing number of partners that support HiGig," said John Mui, Senior Product Line Manager at Broadcom Corporation. "The low power LatticeECP3 FPGA family, coupled with the HiGig IPcore from Lattice, provides a cost effective platform for interfacing with Broadcom devices, enabling high speed Ethernet solutions for the Service Provider, Data Center and Enterprise markets,"

"The small footprint HiGig MAC IP core will help designers develop bridging and switching solutions with Broadcom devices," said Lalit Merani, Lattice Senior Product Marketing Manager. "This is another example of how Lattice has responded to the needs of its customers by focusing on low-cost and low-power design with the LatticeECP3 FPGA family."

The HiGig MAC IP core developed by Lattice is supported by Lattice’s IPexpress™ FPGA design tool module. Included as a standard feature in the Lattice Diamond™ design environment, the IPexpress module significantly reduces design time by allowing IP parameterization and timing analysis on the designer’s desktop. This allows users to customize Lattice's extensive library of IP functions for their unique applications, integrate them with their proprietary FPGA logic designs and evaluate the overall device operation via simulation and timing analysis prior to making any IP purchase commitments.

Pricing and Availability

The HiGig MAC IP core is available now and can be ordered through Lattice sales with a low list price of $5,000. For more information about the IP core please visit http://www.latticesemi.com/products/intellectualproperty/ipcores/higigethernetmac/index.cfm.

About the LatticeECP3 FPGA Family

The LatticeECP3 FPGA family is comprised of five devices that offer standards-compliant multi-protocol 3.2G SERDES, DDR1/2/3 memory interfaces and high performance, cascadable DSP slices that are ideal for high performance RF, baseband and image signal processing. Toggling at 1Gbps, the LatticeECP3 FPGAs also feature fast LVDS I/O as well as embedded memory of up to 6.8 Mbits. Logic density varies from 17K LUTs to 149K LUTs with up to 586 user I/O. The LatticeECP3 FPGA family is ideally suited for deployment in high volume cost- and power-sensitive wireline and wireless infrastructure applications.

Lattice is the source for innovative FPGA, PLD, programmable Power Management and Clock Management solutions. For more information, visit http://www.latticesemi.com

Mar 28, 2011 -

New Low Cost Breakout Boards Accelerate PLD Design and Hardware Evaluation

Feb 14, 2011 -

Lattice at Embedded World: New Products and Technologies for Embedded Design Applications

Feb 07, 2011 -

Lattice Announces Five New IP Suites for the LatticeECP3 FPGA Family

Nov 08, 2010 -

Lattice MachXO2 PLD Family Sets New Standards for Low Cost, Low Power Designs

Nov 02, 2010 -

New PCI Express Root Complex Lite Solution Uses the LatticeECP3 FPGA Family

Oct 30, 2010 -

New PAC-Designer 6.0 Software Enables Designers to Transform Board Management with New Platform Manager Devices

Oct 18, 2010 -

Lattice Ships 50 Millionth MachXO Programmable Logic Device

Oct 12, 2010 -

New Lattice "Platform Manager" Transforms Board Power and Digital Management

Oct 12, 2010 -

Lattice Announces Update to ispLEVER FPGA Design Tool Suite

Oct 11, 2010 -

C-Compiler Support Now Available for LatticeMico8 Microcontroller

7 more news from Lattice Semiconductor »

Nov 18, 2024 -

IPC Celebrates National Apprenticeship Week with a Focus on Electronics Manufacturing Excellence

Nov 18, 2024 -

IPC Introduces First Standard for In-Mold Electronics

Nov 18, 2024 -

Disruptive Innovation and Generative AI Inventor, Kevin Surace, to Keynote IPC APEX EXPO 2025

Nov 18, 2024 -

Etek Europe Expands Partnership with ITW EAE to Represent Despatch Products in the UK and Ireland

Nov 18, 2024 -

Kurtz Ersa Honors Jean Verchere's 30 Years of Dedication as He Retires

Nov 18, 2024 -

KIC Launches Game-Changing TAS Software Platform to Address Emerging Thermal Process Challenges

Nov 18, 2024 -

Nordson Test & Inspection Receives Top Honor with Prime Step-by-Step Innovation Award for SQ3000M2 System

Nov 18, 2024 -

Scienscope's New Xspection 3120 Inspects Long PCBs

Nov 18, 2024 -

PARMI USA, INC. Appoints Juan Arango as Head of Sales and Business Development to Drive U.S. Market Growth

Nov 18, 2024 -

Naprotek Welcomes Aerospace and Defense Veteran to Board of Directors

See electronics manufacturing industry news »

LatticeECP3 Device Is First Low Cost FPGA to Support Broadcom HiGigTM Protocol news release has been viewed 1008 times

  • SMTnet
  • »
  • Industry News
  • »
  • LatticeECP3 Device Is First Low Cost FPGA to Support Broadcom HiGigTM Protocol
Encapsulation Dispensing, Dam and Fill, Glob Top, CSOB

convection smt reflow ovens