FINETECH to Showcase Sub-Micron Bonder at IMAPS Device Packaging 2011

Feb 14, 2011

The FINEPLACER® Lambda sub-micron bonder is ideal for low-volume, prototyping and R&D environments requiring flexibility, precision, advanced technologies and the highest bonding placement accuracy (down to 0.5 micron).

FINETECH will showcase the FINEPLACER® Lambda in Booth #58 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort in Scottsdale, AZ.

The FINEPLACER® Lambda is ideal for low-volume, prototyping and R&D environments requiring flexibility, precision, advanced technologies and the highest bonding placement accuracy (down to 0.5 micron). This versatile system can be used for precise placement, die-attach and advanced packaging utilizing various bonding technologies -- soldering (Eutectic, Au/Sn, Indium), thermo compression, thermo-/ultrasonic bonding, adhesives and UV curing.

Applications include flip chip, 3-D packaging, MEMS, wafer-level packaging (C2W), optoelectronic and micro optics bonding and assembly, sensors, and more.

For more information, visit the company in Booth #58 or at http://www.finetechusa.com.

FINETECH is a leading manufacturer of innovative rework and advance packaging and assembly equipment for the latest advanced packages. The modular design of the FINEPLACER® platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquartered in Berlin, Germany, with offices in Tempe, Arizona; Manchester, New Hampshire; Shanghai, China; and Penang, Malaysia.

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