GOEPEL electronics runs 9th UK Technology Day in 2011

Mar 22, 2011

GOEPEL electronics, leading vendor of JTAG/Boundary Scan equipment and Automated Inspection systems (AOI/AXI) will run its 9th UK Technology Day. This event will take place on the 5th May 2011 in Duxford. The seminars will be covering latest developments, applications and outlooks in JTAG/Boundary Scan, Functional Test and optical inspection technologies.

Electronic and optical test issues from experts for experts

During the Technology Day, GOEPEL electronics Ltd. and well-known partner companies such as Teradyne Inc., Flying Test Systems Ltd., Reflex Technology Ltd., Firecron Ltd., Aeroflex Ltd., Pickering Interfaces Ltd., VTI Instruments Ltd., Thurlby Thandar Instruments Distribution Ltd., Accelonix Ltd., MYDATA automation Ltd. and Zen Production Equipment Ltd. will give presentations, demonstrations and live workshops. The event is focused on electronics design and production related technologies and will provide valuable information for test engineers, design engineers and production managers.

Interested parties are welcome to register by contacting Karl Miles by email k.miles(at)goepel.co.uk, phone 01223 858298 or at http://www.technologydays.co.uk.

GOEPEL electronics’ Technology Day is run by experienced application engineers, eager to share their knowledge with the world's test and design community. The event is not primarily planned to present new products; even though GOEPEL electronics’ innovations and general trends have always been a substantial part of the event. In fact users from various fields in the electronics industry give presentations informing their peers about current projects, certain technology benefits and individual experiences. These guest contributions are the event’s highlights.

GOEPEL electronics runs 9th UK Technology Day in 2011 news release has been viewed 1142 times

Oct 13, 2015 -	Goepel Presents Free Webinar on Quality Control of Plug-in Contacts Using 3D Measurement
Jul 20, 2011 -	eXception integrates GOEPEL electronic's Boundary Scan into Teradyne Test Station
Jul 13, 2011 -	GOEPEL electronic supports Picochip in testing next Generation 'Small cell' Baseband chips
Mar 10, 2011 -	GOEPEL electronic improves in-system Programming Capability of Flash Memories
Mar 09, 2011 -	GOEPEL electronic extends BSDL Testbench to Multi Chip Modules and 3D Chips
Mar 03, 2011 -	Cooperation between GOEPEL electronic and DM&P enables new Test Strategies for x86 System-On-Chip
Feb 26, 2011 -	Fast Generation of production-oriented AOI Programs

Dec 02, 2024 -	PDR Offers Advanced Infrared Heating Technology for BGA Rework
Dec 02, 2024 -	SMTA Announces Program for 2025 Ultra High Density Interconnect (UHDI) Symposium
Dec 02, 2024 -	Count On Tools Introduces Custom Yamaha YS12/24 MC12/24 Special Gripper Nozzle
Dec 02, 2024 -	Naprotek to Exhibit at SMTA Silicon Valley for On-the-Spot Hiring
Dec 02, 2024 -	Subdued Electronics Industry Sentiment Continues in November
Dec 02, 2024 -	Durable PCB Assemblies with Advanced Conformal Coating Technology
Nov 27, 2024 -	Introducing "Essemtec TechTalk: Engineering SMT Solutions"
Nov 27, 2024 -	Enhancing Nexperia's Production Capabilities with the Essemtec Fox All-in-One
Nov 27, 2024 -	How to Enhance SMT Production Line Stability: A Comprehensive Guide from Equipment Selection to Maintenance
Nov 25, 2024 -	North American EMS Industry Up 14.7 Percent in October