BGA Inspection, Rework and Repair Course


PCB Inspection Courses

Where | When:

Pennsylvania, Philadelphia | Oct. 29, 2018

Pennsylvania, Philadelphia | Dec. 06, 2018


Manufacturing with Ball Grid Array (BGA) packages generally offers high, first-pass process yields. However, process errors do occur and there is the likelihood of a solder joint defect (insufficient solder, bridging, solder balling, etc.) under the BGA that will require the removal and replacement of the BGA component. If BGA rework requires the removal of the component, special considerations must be taken into account. For instance, excessive heat or improper removal techniques has the potential to cause damage to surrounding lands, other components, or the PCB itself. Rework requires sound practices, proper tools and quality training.

Who Should Attend

This course is geared towards manufacturing, process and quality engineers responsible for implementing and/or controlling the BGA application and inspection process. Those personnel responsible for training operators and technicians to perform BGA assembly inspection or control the manufacturing process would also benefit from this course.


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x-ray inspection system